ADG608BRU datasheet(5/12 Pages) AD

Teilenummer	ADG608BRU

Bauteilbeschribung	3 V/5 V, 4/8 Channel High Performance Analog Multiplexers

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Hersteller	AD [Analog Devices]

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ADG608/ADG609

REV. A

–5–

ABSOLUTE MAXIMUM RATINGS

1

(TA = +25°C unless otherwise noted)

VDD to VSS

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +13 V

VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6.5 V

VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –6.5 V

Analog, Digital Inputs

2

. . . . . . . . . . . . . . –0.3 V to VDD + 2 V

or 20 mA, Whichever Occurs First

Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . 20 mA

Peak Current, S or D

(Pulsed at 1 ms, 10% Duty Cycle Max) . . . . . . . . . . 40 mA

Operating Temperature Range

Industrial (B Version) . . . . . . . . . . . . . . . . –40

°C to +85°C

Extended (T Version) . . . . . . . . . . . . . . . – 55

°C to +125°C

Storage Temperature Range . . . . . . . . . . . . –65

°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . +150

°C

Plastic DIP Package

θ

JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . .

117

°C/W

Lead Temperature, Soldering (10 sec) . . . . . . . . . . +260

°C

SOIC Package

θ

JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 77

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220

°C

TSSOP Package

θ

JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 158°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220

°C

ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >5000 V

NOTES

1Stresses above those listed under “Absolute Maximum Ratings” may cause

permanent damage to the device. This is a stress rating only and functional

operation of the device at these or any other conditions above those listed in the

operational sections of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Only one absolute maximum rating may be applied at any one time.

2Overvoltages at A, S, D or EN will be clamped by internal diodes. Current should

be limited to the maximum ratings given.

PIN CONFIGURATIONS

DIP/SOIC/TSSOP

A0

EN

A1

GND

S2A

S3A

S4A

S2B

S3B

S4B

VSS

S1A

VDD

S1B

DA

DB

1

2

16

15

5

6

7

12

11

10

3

4

14

13

8

9

TOP VIEW

(Not to Scale)

ADG609

A0

EN

S2

S3

S4

VSS

S1

D

1

2

16

15

5

6

7

12

11

10

3

4

14

13

8

9

TOP VIEW

(Not to Scale)

ADG608

A1

A2

S5

S6

S7

GND

VDD

S8

Table I. ADG608 Truth Table

A2

A1

A0

EN

ON SWITCH

X

0

NONE

00

0

1

00

1

2

01

0

1

3

01

1

4

10

0

1

5

10

1

6

11

0

1

7

11

1

8

X = Don’t Care

Table II. ADG609 Truth Table

A1

A0

EN

ON SWITCH PAIR

X

0

NONE

00

1

01

1

2

10

1

3

11

1

4

X = Don’t Care

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