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AM29F100T-120DTE1 Datenblatt(PDF) 6 Page - Advanced Micro Devices |
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AM29F100T-120DTE1 Datenblatt(HTML) 6 Page - Advanced Micro Devices |
6 / 8 page 6 Am29F100 Known Good Die SU PP L E ME NT PRODUCT TEST FLOW Figure 1 provides an overview of AMD’s Known Good Die test flow. For more detailed information, refer to the Am29F100 product qualification database supplement for KGD. AMD implements quality assurance proce- dures throughout the product test flow. In addition, an off-line quality monitoring program (QMP) further guar- antees AMD quality standards are met on Known Good Die products. These QA procedures also allow AMD to produce KGD products without requiring or imple- menting burn-in. Figure 1. AMD KGD Product Test Flow Wafer Sort 1 Bake 24 hours at 250 °C Wafer Sort 2 Wafer Sort 3 High Temperature Packaging for Shipment Shipment DC Parameters Functionality Programmability Erasability Data Retention DC Parameters Functionality Programmability Erasability DC Parameters Functionality Programmability Erasability Speed Incoming Inspection Wafer Saw Die Separation 100% Visual Inspection Die Pack |
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