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DAC714U Datenblatt(PDF) 3 Page - Burr-Brown (TI)

[Old version datasheet] Texas Instruments acquired Burr-Brown Corporation. Click here to check the latest version.
Teilenummer DAC714U
Bauteilbeschribung  16-Bit DIGITAL-TO-ANALOG CONVERTER With Serial Data Interface
Download  14 Pages
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Hersteller  BURR-BROWN [Burr-Brown (TI)]
Direct Link  http://www.burr-brown.com
Logo BURR-BROWN - Burr-Brown (TI)

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3
®
DAC714
LINEARITY ERROR
TEMPERATURE
PRODUCT
PACKAGE
max at +25
°C
RANGE
DAC714P
Plastic DIP
±4 LSB
–40
°C to +85°C
DAC714U
Plastic SOIC
±4 LSB
–40
°C to +85°C
DAC714HB
Ceramic DIP
±2 LSB
–40
°C to +85°C
DAC714HC
Ceramic DIP
±1 LSB
–40
°C to +85°C
DAC714HL
Ceramic DIP
±1 LSB
0
°C to +70°C
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant
any BURR-BROWN product for use in life support devices and/or systems.
PIN CONFIGURATION
Top View
ELECTROSTATIC
DISCHARGE SENSITIVITY
Electrostatic discharge can cause damage ranging from per-
formance degradation to complete device failure. Burr-
Brown Corporation recommends that all integrated circuits
be handled and stored using appropriate ESD protection
methods.
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet
published specifications.
CLK
A
0
A
1
SDI
SDO
DCOM
+V
CC
ACOM
DAC714
CLR
–V
CC
Gain Adjust
Offset Adjust
V
REF OUT
R
BPO
R
FB2
V
OUT
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
PIN DESCRIPTIONS
PIN
LABEL
DESCRIPTION
1
CLK
Serial Data Clock
2A0
Enable for Input Register (Active Low)
3A1
Enable for D/A Latch (Active Low)
4
SDI
Serial Data Input
5
SDO
Serial Data Output
6
DCOM
Digital Ground
7+VCC
Positive Power Supply
8
ACOM
Analog Ground
9VOUT
D/A Output
10
RFB2
±10V Range Feedback Output
11
RBPO
Bipolar Offset
12
VREF OUT
Voltage Reference Output
13
Offset Adjust
Offset Adjust
14
Gain Adjust
Gain Adjust
15
–VCC
Negative Power Supply
16
CLR
Clear
ORDERING INFORMATION
SOIC/DIP
+VCC to Common .................................................................... 0V to +17V
–VCC to Common .................................................................... 0V to –17V
+VCC to –VCC ....................................................................................... 34V
ACOM to DCOM ...............................................................................
±0.5V
Digital Inputs to Common ............................................. –1V to (VCC –0.7V)
External Voltage Applied to BPO and Range Resistors .....................
±V
CC
VREF OUT ......................................................... Indefinite Short to Common
VOUT ............................................................... Indefinite Short to Common
SDO ............................................................... Indefinite Short to Common
Power Dissipation .......................................................................... 750mW
Storage Temperature ...................................................... –60
°C to +150°C
Lead Temperature (soldering, 10s) ................................................ +300
°C
NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings”
may cause permanent damage to the device. Exposure to absolute maximum
conditions for extended periods may affect device reliability.
ABSOLUTE MAXIMUM RATINGS(1)
PACKAGE DRAWING
PRODUCT
PACKAGE
NUMBER(1)
DAC714P
Plastic DIP
180
DAC714U
Plastic SOIC
211
DAC714H
Ceramic DIP
129
NOTE: (1) For detailed drawing and dimension table, please see end of data sheet,
or Appendix C of Burr-Brown IC Data Book.
PACKAGE INFORMATION


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