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AD8229HRZ Datenblatt(PDF) 6 Page - Analog Devices |
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AD8229HRZ Datenblatt(HTML) 6 Page - Analog Devices |
6 / 24 page AD8229 Data Sheet Rev. B | Page 6 of 24 ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Rating Supply Voltage ±17 V Output Short-Circuit Current Duration Indefinite Maximum Voltage at –IN, +IN1 ±VS Differential Input Voltage1 Gain ≤ 4 ±VS 4 > Gain > 50 ±50 V/gain Gain ≥ 50 ±1 V Maximum Voltage at REF ±VS Storage Temperature Range −65°C to +150°C Specified Temperature Range SBDIP −40°C to +210°C SOIC −40°C to +175°C Maximum Junction Temperature SBDIP 245°C SOIC 200°C ESD Human Body Model 4 kV Charge Device Model 1.5 kV Machine Model 200 V 1 For voltages beyond these limits, use input protection resistors. See the Theory of Operation section for more information. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PREDICTED LIFETIME VS. OPERATING TEMPERATURE Comprehensive reliability testing is performed on the AD8229. Product lifetimes at extended operating temperature are obtained using high temperature operating life (HTOL). Lifetimes are predicted from the Arrhenius equation, taking into account potential design and manufacturing failure mechanism assump- tions. HTOL is performed to JEDEC JESD22-A108. A minimum of three wafer fab and assembly lots are processed through HTOL at the maximum operating temperature. Comprehensive reliability testing is performed on all Analog Devices, Inc., high temperature (HT) products. 1 100k 10k 1k 100 10 120 210 200 190 180 170 160 150 140 130 OPERATING TEMPERATURE (°C) Figure 3. Predicted Lifetime vs. Operating Temperature Refer to the AD8229 Predicted Lifetime vs. Operating Temperature document for the most up-to-date reliability data. THERMAL RESISTANCE θJA is specified for a device in free air using a 4-layer JEDEC printed circuit board (PCB). Table 3. Package Type θJA Unit 8-Lead SBDIP 100 °C/W 8-Lead SOIC 121 °C/W ESD CAUTION |
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