CYStech Electronics Corp.

Spec. No. : C496Q8

Issued Date : 2008.06.04

Revised Date :2008.07.29

Page No. : 6/6

LM103AQ8

CYStek Product Specification

SOP-8 Dimension

*: Typical

Inches

Millimeters

Inches

Millimeters

8-Lead SOP-8 Plastic Package

CYStek Package Code: Q8

Marking:

Top View

A

B

Front View

F

C

D

E

G

Part A

I

H

J

K

O

M

L

N

Right side View

Part A

LM103A

□□□□

Device

Name

Date

Code

DIM

Min.

Max.

Min.

Max.

DIM

Min.

Max.

Min.

Max.

A

0.1909

0.2007

4.85

5.10

I

0.0019

0.0078

0.05

0.20

B

0.1515

0.1555

3.85

3.95

J

0.0118

0.0275

0.30

0.70

C

0.2283

0.2441

5.80

6.20

K

0.0074

0.0098

0.19

0.25

D

0.0480

0.0519

1.22

1.32

L

0.0145

0.0204

0.37

0.52

E

0.0145

0.0185

0.37

0.47

M

0.0118

0.0197

0.30

0.50

F

0.1472

0.1527

3.74

3.88

N

0.0031

0.0051

0.08

0.13

G

0.0570

0.0649

1.45

1.65

O

0.0000

0.0059

0.00

0.15

H

0.1889

0.2007

4.80

5.10

2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.

Material:

• Lead: Solder plating

• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.

• CYStek reserves the right to make changes to its products without notice.

• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.