1.2

INCH

SINGLE

DIGIT

DISPLAY

C-1201G

REV:A / 0

—SOLDERING

METHOD

SOLDERING CONDITIONS

REMARK

DIP

SOLDERING

Bath temperature: 260 max

Immersion time: within 5 sec

the base of the package

— Using soldering flux,

” RESIN FLUX”

is recommended.

SOLDERING

IRON

Soldering iron: 30W or smaller

Temperature at tip of iron: 260

or lower

℃

Soldering time: within 5 sec.

— During soldering, take care not to

press the tip of iron against the

PIN.

(To prevent heat from being

transferred directly to the PIN.)

1) When soldering the PIN of Display in a jig that the package is fixed with a panel (See fIg.1), be

careful not to stress the PIN with iron tip. When soldering Display in a condition that the package

is fixed with a panel, be careful not to cling and stress the surface of Display on the panel to avoid

damaging the Display.

Regarding solution in the tinning oven for product-tinning, compound sub-solution made of tin &

copper and silver is proposed with the temperature of Celsius 260. The proportion of the

alloyed solution is tin 95.5: copper 3.5: silver 0.5 by percentage. The time of tinning is constantly

3 seconds.

DRAWING NO. : DS-11-09-0053

DATE : 2009-04-02

Page : 6

Fig.1

Release

by

PARALIGHTDCC