Mechanical Dimensions

Dimension in Millimeters

TO-251 3L (IPAK)

Figure

18. TO251 (IPAK) Molded 3 Lead

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or

obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specif-

ically the warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/package/packageDetails.html?id=PN_TO251-003

.

©2000 Fairchild Semiconductor Corporation

FQD9N25 / FQU9N25 Rev. C1

www.fairchildsemi.com

9