Datenblatt-Suchmaschine für elektronische Bauteile |
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SM100 Datenblatt(PDF) 3 Page - StarHope |
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SM100 Datenblatt(HTML) 3 Page - StarHope |
3 / 3 page Termination pad characteristics Terminal pad materials Tin-Plated Nickle-Copper or Gold-Plated Nickle-Copper Terminal pad solderability Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3. Thermal Derating Curve Typical Time-To-Trip At 25°C Derating Curves for SMD Series 0 20 40 60 80 100 120 140 160 -40 -20 0 20 40 60 80 Temperature (°C) Average Time Current Curves 0.01 0.1 1 10 100 0 0 1 0 1 1 1 . 0 Current In Amperes 3.00A 0.50A 0.75A 1.00A 1.25A 1.5A 1.85A 2.0A 2.5A 2.6A 0.3A Package Information Reel: SM030~300 2000pcs/Reel Recommended Solder Reflow Conditions Soldering ‧Recommended reflow methods:IR, vapor phase oven, hot air oven. ‧Devices are not designed to be wave soldered to the bottom side of the board. ‧Recommended maximum paste thickness is 0.25 mm (0.010 inch). ‧Devices can be cleaned using standard method and solvents. Note:If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. SM SMD SeriesPreheating Cooling 60-120 sec. 120 sec. 30-60 sec. 300 200 160 0 250 190 100 PPTC/SM Series 03 | www.spsemi.cn REV.2014.05.01 |
Ähnliche Teilenummer - SM100 |
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Ähnliche Beschreibung - SM100 |
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