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LM49352 Datenblatt(PDF) 8 Page - Texas Instruments

Teilenummer LM49352
Bauteilbeschribung  Mono Class D Audio Codec Subsystem with Ground Referenced Headphone Amplifiers Earpiece Driver, and Audio DSP
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LM49352
SNAS467D – MARCH 2009 – REVISED JUNE 2010
www.ti.com
PIN DESCRIPTIONS (continued)
Pin
Pin Name
Type
Direction
Description
D6
DGND
Supply
Input
Digital ground
E1
LSGND
Supply
Input
Loudspeaker ground
E2
LS_VDD
Supply
Input
Loudspeaker amplifier and analog mixer (headphone) supply input
E3
MONO-
Analog
Input
Mono differential negative input
E4
MIC-
Analog
Input
Microphone negative input
E5
PORT1_SDI
Digital
Input
Audio Port 1 serial data input
DAC (Digital), ADC (Digital), PLL (Digital), digital mixer, DSP core, and I2C
E6
D_VDD
Supply
Input
register power supply input
F1
LS +
Analog
Output
Loudspeaker positive output
F2
LS -
Analog
Output
Loudspeaker negative output
F3
MONO+
Analog
Input
Mono differential positive input
F4
MIC +
Analog
Input
Microphone positive input
F5
PORT1_CLK
Digital
Input/Output
Audio Port 1 clock signal (can be master or slave)
F6
I/O_VDD
Supply
Input
Digital I/O (MCLK, I2S/PCM, I2C) interface power supply input
PIN TYPE DEFINITIONS
Analog Input — A pin that is used by the analog and is never driven by the device. Supplies are part of this
classification.
Analog Output — A pin that is driven by the device and should not be driven by external sources.
Analog Input/Output — A pin that is typically used for filtering a DC signal within the device. Passive
components can be connected to these pins.
Digital Input — A pin that is used by the digital but is never driven by the device.
Digital Output — A pin that is driven by the device and should not be driven by another device to avoid
contention.
Digital Input/Output — A pin that is either open drain (SDA) or a bidirectional CMOS in/out. In the latter case the
direction is selected by a control register within the LM49352.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
8
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