Datenblatt-Suchmaschine für elektronische Bauteile |
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LM3676 Datenblatt(PDF) 3 Page - Texas Instruments |
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LM3676 Datenblatt(HTML) 3 Page - Texas Instruments |
3 / 23 page LM3676 www.ti.com SNVS426B – NOVEMBER 2006 – REVISED MARCH 2007 Absolute Maximum Ratings (1) VIN Pin: Voltage to GND −0.2V to 6.0V FB, SW, EN, Mode Pin: (GND −0.2V) to (VIN + 0.2V) Continuous Power Dissipation (2) Internally Limited Junction Temperature (TJ-MAX) +125°C Storage Temperature Range −65°C to +150°C Maximum Lead Temperature 260°C (Soldering, 10 sec.) ESD Rating (3) Human Body Model 2 kV Machine Model 200V (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics tables. (2) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ= 150°C (typ.) and disengages at TJ= 130°C (typ.). (3) The Human body model is a 100 pF capacitor discharged through a 1.5 k Ω resistor into each pin. The machine model is a 200 pF capacitor discharged directly into each pin. MIL-STD-883 3015.7 Operating Ratings (1) (2) Input Voltage Range 2.9V to 5.5V Recommended Load Current 0mA to 600 mA Junction Temperature (TJ) Range −30°C to +125°C Ambient Temperature (TA) Range (3) −30°C to +85°C (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics tables. (2) All voltages are with respect to the potential at the GND pin. (3) In Applications where high power dissipation and/or poor package resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX), the maximum power dissipation of the device in the application (PD-MAX) and the junction to ambient thermal resistance of the package (θJA) in the application, as given by the following equation:TA-MAX= TJ-MAX− (θJAx PD-MAX). Refer to Dissipation rating table for PD-MAX values at different ambient temperatures. Thermal Properties Junction-to-Ambient Thermal Resistance ( θJA) for 4 layer board (1) 56°C/W (1) Junction to ambient thermal resistance is highly application and board layout dependent. In applications where high power dissipation exists, special care must be given to thermal dissipation issues in board design. Specified value of 130 °C/W for LLP is based on a 4 layer, 4" x 3", 2/1/1/2 oz. Cu board as per JEDEC standards is used. Copyright © 2006–2007, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM3676 |
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