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LM3676 Datenblatt(PDF) 3 Page - Texas Instruments

Teilenummer LM3676
Bauteilbeschribung  2MHz, 600mA Step-Down DC-DC Converter with Mode Control
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LM3676
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SNVS426B – NOVEMBER 2006 – REVISED MARCH 2007
Absolute Maximum Ratings
(1)
VIN Pin: Voltage to GND
−0.2V to 6.0V
FB, SW, EN, Mode Pin:
(GND
−0.2V) to
(VIN + 0.2V)
Continuous Power Dissipation (2)
Internally Limited
Junction Temperature (TJ-MAX)
+125°C
Storage Temperature Range
−65°C to +150°C
Maximum Lead Temperature
260°C
(Soldering, 10 sec.)
ESD Rating (3)
Human Body Model
2 kV
Machine Model
200V
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under
which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed
performance limits and associated test conditions, see the Electrical Characteristics tables.
(2)
Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ= 150°C (typ.) and
disengages at TJ= 130°C (typ.).
(3)
The Human body model is a 100 pF capacitor discharged through a 1.5 k
Ω resistor into each pin. The machine model is a 200 pF
capacitor discharged directly into each pin. MIL-STD-883 3015.7
Operating Ratings
(1) (2)
Input Voltage Range
2.9V to 5.5V
Recommended Load Current
0mA to 600 mA
Junction Temperature (TJ) Range
−30°C to +125°C
Ambient Temperature (TA) Range
(3)
−30°C to +85°C
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under
which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed
performance limits and associated test conditions, see the Electrical Characteristics tables.
(2)
All voltages are with respect to the potential at the GND pin.
(3)
In Applications where high power dissipation and/or poor package resistance is present, the maximum ambient temperature may have
to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX), the
maximum power dissipation of the device in the application (PD-MAX) and the junction to ambient thermal resistance of the package (θJA)
in the application, as given by the following equation:TA-MAX= TJ-MAX− (θJAx PD-MAX). Refer to Dissipation rating table for PD-MAX values at
different ambient temperatures.
Thermal Properties
Junction-to-Ambient Thermal Resistance (
θJA) for 4 layer board
(1)
56°C/W
(1)
Junction to ambient thermal resistance is highly application and board layout dependent. In applications where high power dissipation
exists, special care must be given to thermal dissipation issues in board design. Specified value of 130 °C/W for LLP is based on a 4
layer, 4" x 3", 2/1/1/2 oz. Cu board as per JEDEC standards is used.
Copyright © 2006–2007, Texas Instruments Incorporated
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