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CB230 Datenblatt(PDF) 2 Page - Marktech Corporate

Teilenummer CB230
Bauteilbeschribung  Generation II LEDs
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Hersteller  MARKTECH [Marktech Corporate]
Direct Link  http://www.marktechopto.com
Logo MARKTECH - Marktech Corporate

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Copyright © 2008 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the
Cree logo and G•SiC are registered trademarks, and SuperBlue is a trademark of Cree, Inc.
2
CPR3DM Rev. -
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
www.cree.com
Maximum Ratings at T
A = 25°C
Notes &3
C430CB230-S200
DC Forward Current
15 mA
Peak Forward Current (1/10 duty cycle @ 1kHz)
35 mA
LED Junction Temperature
125°C
Reverse Voltage
5 V
Operating Temperature Range
-40°C to +100°C
Storage Temperature Range
-40°C to +100°C
Electrostatic Discharge Threshold (HBM)Note 2
1000 V
Electrostatic Discharge Classification (MIL-STD-883E)Note 2
Class 2
Typical Electrical/Optical Characteristics at T
A = 25°C, If = 0 mA
Note 3
Part Number
Forward
Voltage
(V
f, V)
Radiant Flux
(P, mW)
Reverse
Current
[I(Vr=5V), μA]
Peak
Wavelength
(
λ
d, nm)
Dominant
Wavelength
(
λ
d, nm)
Full Width
Half Max
(
λ
D, nm)
Typ.
Max.
Min.
Typ.
Max.
Typ.
Min.
Typ.
Max.
Typ.
C430CB230-S2100
4.0
4.5
0.425
0.80
10
423
461
463
465
59
Mechanical Specifications
C430CB230-S000
Description
Dimension
Tolerance
P-N Junction Area (μm 2)
180 x 180
± 35
Top Area (μm 2)
200 x 200
± 35
Bottom Area (μm 2)
200 x 200
± 35
Chip Thickness (μm)
250
± 25
Au Bond Pad Diameter (μm)
114
± 20
Au Bond Pad Thickness (μm)
1.1
± 0.5
Back Contact Metal Diameter (μm)
114
± 20
Notes:
Maximum ratings are package dependent. The above ratings were determined using a T-1 3/4 package (with Hysol OS4000
epoxy) for characterization. Ratings for other packages may differ. The forward currents (DC and Peak) are not limited by the die
but by the effect of the LED junction temperature on the package. The junction temperature limit of 125°C is a limit of the T-1
3/4 package; junction temperature should be characterized in a specific package to determine limitations. Assembly processing
temperature must not exceed 325°C (<5 seconds).
Product resistance to electrostatic discharge (ESD) according to the HBM is measured by simulating ESD using a rapid avalanche
energy test (RAET). The RAET procedures are designed to approximate the maximum ESD ratings shown. The ESD classification
of Class II is based on sample testing according to MIL-STD-883E.
All products conform to the listed minimum and maximum specifications for electrical and optical characteristics, when assembled
and operated at 10 mA within the maximum ratings shown above. Efficiency decreases at higher currents. Typical values given
are within the range of average values expected by the manufacturer in large quantities and are provided for information only. All
measurements were made using lamps in T-1 3/4 packages (with Hysol OS4000 epoxy). Optical characteristics measured in an
integrating sphere using Illuminance A.
1.
2.
3.


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