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ADC08DL500CIVV Datenblatt(PDF) 10 Page - Texas Instruments

Teilenummer ADC08DL500CIVV
Bauteilbeschribung  ADC08DL500 Low Power, 8-Bit, Dual 500 MSPS A/D Converter
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ADC08DL500CIVV Datenblatt(HTML) 10 Page - Texas Instruments

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ADC08DL500
SNAS495C – MARCH 2011 – REVISED MARCH 2011
www.ti.com
Operating Ratings
(1) (2) (continued)
Ambient Temperature Range (3)
−40°C ≤ TA ≤ +70°C
Supply Voltage (VA)
+1.8V to +2.0V
Driver Supply Voltage (VDR)
+1.8V to VA
Common Mode Input Voltage
VCMO ± 50 mV
VIN+, VIN− Voltage Range (Maintaining Common Mode)
0V to 2.15V
(100% duty cycle)
0V to 2.5V
(10% duty cycle)
Ground Difference
(|GND
− DR GND|)
0V
CLK Pins Voltage Range
0V to VA
Differential CLK Amplitude
0.4VP-P to 2.0VP-P
Common Mode Input Voltage
VCMO - 50mV < VCMI < VCMO + 50mV
(3)
The 4-layer standard JEDEC thermal test board or 4LJEDEC is 4"x3" in size. The board has two embedded copper layers which cover
roughly the same size as the board. The copper thickness for the four layers, starting from the top one, is 2 oz., 1 oz., 1 oz., 2 oz.
Detailed description of the board can be found in the JESD 51-7 standard.
Package Thermal Resistance
(1) (2)
Package
θJA
θJC
psiJB
144-Lead,
43.6°C / W
12.5°C / W
39.0°C / W
LQFP
(1)
Soldering process must comply with National Semiconductor’s Reflow Temperature Profile specifications. Refer to
www.national.com/packaging.
(2)
Reflow temperature profiles are different for lead-free and non-lead-free packages.
10
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Product Folder Links: ADC08DL500


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