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F-XSD Datenblatt(PDF) 4 Page - Microdc power Technology Co., Ltd

Teilenummer F-XSD
Bauteilbeschribung  Isolated 1W Dual Single Output DC/DC Converters
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Hersteller  MICRODC [Microdc power Technology Co., Ltd]
Direct Link  http://www.microdc.cn/
Logo MICRODC - Microdc power Technology Co., Ltd

F-XSD Datenblatt(HTML) 4 Page - Microdc power Technology Co., Ltd

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(S)D&F-X
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Series
eries
http://www.microdc.cn
Technical Enquiries-Email:tech@microdc.cn Tel:0086-20-86000646
Page 4 of 4
PACKAGE
PACKAGE SPECIFICATIONS
SPECIFICATIONS
MECHANICAL
MECHANICAL DIMENSIONS
DIMENSIONS
DIP
DIP package
package
SIP
SIP package
package
*Pin not fitted on single output variants.
All dimensions in inches ±0.01(mm±0.25mm).All pins on a 0.1(2.54) pitch and within ±0.01(0.25)of true
position.
Weight: 2.4g (DIP) 2.1g (SIP)
PIN
PIN CONNECTIONS
CONNECTIONS
SINGLE
SINGLE OUTPUT
OUTPUT VARIANTS
VARIANTS
PIN
PIN CONNECTIONS-14
CONNECTIONS-14 PIN
PIN DIP
DIP
pin
Function
1
1
-VIN
-VIN
7
7
NC
NC
8
8
+VOUT
+VOUT
10
10
-VOUT
-VOUT
14
14
+VIN
+VIN
PIN
PIN CONNECTIONS-7
CONNECTIONS-7 PIN
PIN SIP
SIP
pin
Function
1
1
+VIN
+VIN
2
2
-VIN
-VIN
5
5
-VOUT
-VOUT
7
7
+VOUT
+VOUT
DUAL
DUAL OUTPUT
OUTPUT VARIANTS
VARIANTS
PIN
PIN CONNECTIONS-14
CONNECTIONS-14 PIN
PIN DIP
DIP
pin
Function
1
1
-VIN
-VIN
7
7
NC
NC
8
8
+VOUT
+VOUT
9
9
0V
0V
10
10
-VOUT
-VOUT
14
14
+VIN
+VIN
PIN
PIN CONNECTIONS-7
CONNECTIONS-7 PIN
PIN SIP
SIP
pin
Function
1
1
+VIN
+VIN
2
2
-VIN
-VIN
5
5
-VOUT
-VOUT
6
6
0V
0V
7
7
+VOUT
+VOUT
RECOMMENDED
RECOMMENDED FOOTPRINT
FOOTPRINT DETAILS
DETAILS
14 Pin DIP Package14 Pin DIP Package
7 Pin SIP Package
*Hole not required for single output variants.
TUBE
TUBE OUTLINE
OUTLINE DIMENSIONS
DIMENSIONS
14 Pin DIP Tube
7 Pin SIP Tube
Unless otherwise stated all dimensions in inches ±0.02(mm ±0.5mm).
Tube length(14 Pin DIP):20.47(520mm±2mm).
Tube length( 7 Pin SIP):20.47(520mm±2mm).
Tube Quantity:10
Microdc Professional Power Module,Inc.
Tel:0086-20-86000646 E-mail:tech@microdc.cn
Website:http://www.microdc.cn
Microdc Professional Power module,Inc.makes no representation that
the use of its products in the circuits described herein, or the use of other
technical information contained herein, will not infringe upon existing or
future patent rights. Specifications are subject to change without notice.
2010 Microdc Professional Power Module, Inc. Guangzhou
RoHS COMPLIANT INFORMATION
This series is compatible with RoHS soldering systems with a peak wave solder temperature
of 300°C for 10 seconds.
The pin termination finish on the SIP package type is Tin Plate, Hot Dipped over Matte Tin
with Nickel Preplate. The DIP types are Matte Tin over Nickel Preplate. Both types in this
series are backward compatible with Sn/Pb soldering systems.
REACH COMPLIANT INFORMATION
This series has proven that this product does not contain harmful chemicals, it also has
harmful chemical substances through the registration, inspection and approval.


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