INFRARED PULSED LASER DIODE

L6690

Cat. No. LLD1002E01

Feb. 1998 T

Printed in Japan (1,000)

■ELECTRICAL AND OPTICAL CHARACTERISTICS (Ta=25℃)

Figure 4: Typical Directivity

INFRARED PULSED LASER DIODE

L6690

■FEATURES

●High duty ratio (DR≦2.5%)

●High speed rise time (tr=0.5 ns typ.)

■APPLICATIONS

●Laser rader

●Range finder

●Excitation light source

●Optical trigger

●Security barrier

■ABSOLUTE MAXIMUM RATINGS

Information furnished by HAMAMATSU is believed to be reliable. However, no responsibility is assumed for possible inaccuracies or omissions.

Specifications are subject to change without notice. No patent rights are granted to any of the circuits described herein. 1998 Hamamatsu Photonics K.K.

http://www.hamamatsu.com

HAMAMATSU PHOTONICS K.K., International Sales Division

325-6, Sunayama-cho, Hamamatsu City, 430-8587, Japan, Telephone: (81)53-452-2141, Fax: (81)53-456-7889

U.S.A.: Hamamatsu Corporation:360 Foothill Road, P.O. BOX 6910, Bridgewater, N.J. 08807-0910, U.S.A.Telephone: (1)908-231-0960, Fax: (1)908-231-1218 E-mail: usa@hamamatsu.com

Germany: Hamamatsu Photonics Deutschland GmbH: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: (49)8152-375-0, Fax: (49)8152-2658, E-mail: info@hamamatsu.de

France: Hamamatsu Photonics France S.A.R.L.: 8, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: 33(1) 69 53 71 00, Fax: 33(1) 69 53 71 10, E-mail: france@hamamatsu.com

United Kingdom: Hamamatsu Photonics UK Limited: 2 Howard Court, 10 Tewin Road, Welwyn Garden City, Hertfordshire AL7 1BW, United Kingdom, Telephone: (44)1707-294888, Fax: (44)1707-325777, E-mail: info@hamamatsu.co.uk

North Europe: Hamamatsu Photonics Norden AB: Smidesv gen 12, SE-171-41 Solna, Sweden, Telephone: (46)8-509-031-00, Fax: (46)8-509-031-01, E-mail: info@hamamatsu.se

Italy: Hamamatsu Photonics Italia S.R.L.: Strada della Moia, 1/E, 20020 Arese, (Milano), Italy, Telephone: (39)02-935 81 733, Fax: (39)02-935 81 741, E-mail: info@hamamatsu.it

Figure 2: Typical Radiant Power vs.

Pulsed Forward Current

Figure 3: Typical Emission Spectrum

Unit

W

nm

nm

V

ns

degree

degree

A

mA

Min.

1.8

-

-

-

-

6

27

-

-

Symbol

DR

Value

3

2

3

130

2.5

-35 to +80

-40 to +85

Unit

A

V

W

ns

%

℃

℃

Parameter

Pulsed Radiant Power

Peak Emission Wavelength

Spectral Radiation Half Bandwidth

Forward Voltage

Rise Time

Beam Spread Angle : Parallel

: Vertical

Lasing Threshold Current

Monitor PD Current

Symbol

λp

Δλ

tr

θ//

θ⊥

Ith

Im

Condition

FWHM

FWHM

Typ.

-

870

3

2.7

0.5

8

30

0.5

0.25

Max.

-

-

-

-

-

10

33

-

-

Note: General operating condition

Parameter

Pulsed Foward Current

Reverse Voltage

Pulsed Radiant Output Power

Pulse Duration (FWHM)

Duty Ratio

Operating Temperature

Storage Temperature

Figure 1: Dimensional Outline (Unit: mm)

9.0

Side View

Bottom View

5.7

2.54

1.0

PD

LD

0.45

2.8

Glass Window

LD Chip

Common to Case

(Pin Connection)

LD Cathode

PD Anode

LD Cathode

PD Anode

Common to Case

+0

-0.1

Handling Precautions for L6690

1. Precautions for handling

The LD (laser diode) may be damaged or its performance may deteriorate

due to such factors as electrostatic discharge from the human body, surge

voltages from measurement equipment, leakage voltages from soldering

irons, and packing materials. As a countermeasure against static electricity,

the device, operator, work place and measuring jigs must all be set at the

same electric potential. In using LD, observe the following precautions:

・To protect the device from static electricity charges which accumulate on

the operator or the operator’s clothes, use a wrist strap etc. to ground the

operator’s body via a high impedance resistor (1M

Ω).

・A semiconductive sheet should be laid on both the work table and the

floor in the work area. When soldering, use an electrically grounded solder-

ing iron with an isolation resistance of more than 10M

Ω.

・For containers for transportation and packing, use of antistatic material

(material that minimizes the generation of static change when rubbed

against or separated from itself or other similar materials).

2. Precautions for mounting

(1)Lead forming

To form the leads, hold the base of the leads securely and bend them so

that no force is applied to the package. Lead forming should be done be-

fore soldering.

(2)Cutting off the leads

If leads are out when still at a high temperature, this may cause an electri-

cal discontinuity. Always cut off the leads when they are at room tempera-

ture. Never cut off the leads immediately after they are soldered.

(3)Soldering

Using a low-temperature melting solder (below 200

℃), solder the leads

at the temperature and dwell time specified as follows.

Maximum Soldering Temperature: 230

℃

Maximum Soldering Time: 5 seconds (1 second for devices having a

lead length less than 2mm)

If these conditions cannot be met, it is recommended that some form of

heat sink be used at the base of the lead so that the solder heat is not

conducted to the package. Also be careful not to apply excessive force to

the leads during soldering.

Soldering at excessive temperatures and dwell times may cause the

roots of the leads to crack, resulting in performance deterioration. This

sometimes leads to wiring breakage. If the leads are soldered while exter-

nal force is applied to the device, the residual force tends to degrade de-

vice performance. Care should also be taken not to apply force to the

leads during soldering.

In addition, when soldering an LD. use a soldering iron with its metallic

parts grounded to prevent damage to the device from static discharge.

Do not use any flux which is highly acidic. alkaline or inorganic because

it may cause the component leads to erode.

Use a rosin flux.

3.Protection against laser beams

The LD is classified into class 3B according to the laser product stan-

dards of the lEC825-1 (Radiation safety of laser products Part1: Equip-

ment classification, requirements and user’s guide). The operator must

avoid eye or skin exposure to the laser beam. When viewing the laser

beam, be sure to wear safety goggles that block infrared radiation.

3.0

2.5

2.0

1.5

1.0

0

0.5

0.5

0

1.0

1.5

2.0

2.5

3.0

(Ta=25

℃)

100

80

60

40

20

0

870

890

910

830

850

WAVELENGTH (nm)

(Ta=25

℃)

80

60

100

40

20

0

30

40

20

10

0

10

20

30

40

ANGLE (degree)

℃)

Vertical Direction

Top View

Parallel

Direction

Top View

○

C