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HCPL-2219 Datenblatt(PDF) 8 Page - Agilent(Hewlett-Packard)

Teilenummer HCPL-2219
Bauteilbeschribung  Very High CMR, Wide VCC Logic Gate Optocouplers
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Hersteller  HP [Agilent(Hewlett-Packard)]
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HCPL-2219 Datenblatt(HTML) 8 Page - Agilent(Hewlett-Packard)

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VDE 0884 Insulation Related Characteristics (HCNW22XX ONLY)
Description
Symbol
Characteristic
Units
Installation classification per DIN VDE 0110/1.89, Table 1
for rated mains voltage
≤ 600 V rms
I-IV
for rated mains voltage
≤ 1000 V rms
I-III
Climatic Classification
55/100/21
Pollution Degree (DIN VDE 0110/1.89)
2
Maximum Working Insulation Voltage
VIORM
1414
V peak
Input to Output Test Voltage, Method b*
VIORM x 1.875 = VPR, 100% Production Test with tm = 1 sec,
VPR
2652
V peak
Partial Discharge < 5 pC
Input to Output Test Voltage, Method a*
VIORM x 1.5 = VPR, Type and sample test,
VPR
2121
V peak
tm = 60 sec, Partial Discharge < 5 pC
Highest Allowable Overvoltage*
(Transient Overvoltage, tini = 10 sec)
VIOTM
8000
V peak
Safety Limiting Values
(Maximum values allowed in the event of a failure,
also see Figure 12, Thermal Derating curve.)
Case Temperature
TS
150
°C
Current (Input Current IF, PS = 0)
IS,INPUT
400
mA
Output Power
PS,OUTPUT
700
mW
Insulation Resistance at TS, VIO = 500 V
RS
≥ 109
*Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section (VDE 0884), for a
detailed description.
Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in
application.
Absolute Maximum Ratings
Parameter
Symbol
Min.
Max.
Units
Note
Storage Temperature
TS
-55
125
°C
Operating Temperature
TA
-40
85
°C
Average Forward Input Current
IF(AVG)
10
mA
1
Peak Transient Input Current
(
≤ 1 µs Pulse Width, 300 pps)
IF(TRAN)
1.0
A
1
(
≤ 200 µs Pulse Width,
HCNW22XX
40
mA
< 1% Duty Cycle)
Reverse Input Voltage
VR
5V
1
HCNW22XX
3
Average Output Current
IO
25
mA
1
Supply Voltage
VCC
020
V
Output Voltage
VO
-0.5
20
V
1
Total Package Power Dissipation
PT
210
mW
2
HCPL-223X
294
Output Power Dissipation
PO
See Figure 7
1
Lead Solder Temperature (Through Hole Parts
260
°C for 10 sec.,
Only)
1.6 mm below seating plane
HCNW22XX
260
°C for 10 sec., up to seating plane
Solder Reflow Temperature Profile (Surface
See Package Outline Drawings section
Mount Parts Only)


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