Datenblatt-Suchmaschine für elektronische Bauteile |
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HCPL3150 Datenblatt(PDF) 4 Page - Agilent(Hewlett-Packard) |
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HCPL3150 Datenblatt(HTML) 4 Page - Agilent(Hewlett-Packard) |
4 / 15 page 1-200 Recommended Operating Conditions Parameter Symbol Min. Max. Units Power Supply Voltage (VCC - VEE) 15 30 Volts Input Current (ON) IF(ON) 716 mA Input Voltage (OFF) VF(OFF) -3.0 0.8 V Operating Temperature TA -40 100 °C Insulation and Safety Related Specifications Parameter Symbol Value Units Conditions Minimum External Air Gap L(101) 7.1 mm Measured from input terminals to output (External Clearance) terminals, shortest distance through air. Minimum External Tracking L(102) 7.4 mm Measured from input terminals to output (External Creepage) terminals, shortest distance path along body. Minimum Internal Plastic Gap 0.08 mm Through insulation distance conductor to (Internal Clearance) conductor. Tracking Resistance CTI 200 Volts DIN IEC 112/VDE 0303 Part 1 (Comparative Tracking Index) Isolation Group IIIa Material Group (DIN VDE 0110, 1/89, Table 1) Option 300 - surface mount classification is Class A in accordance wtih CECC 00802. Absolute Maximum Ratings Parameter Symbol Min. Max. Units Note Storage Temperature TS -55 125 °C Operating Temperature TA -40 100 °C Average Input Current IF(AVG) 25 mA 1 Peak Transient Input Current IF(TRAN) 1.0 A (<1 µs pulse width, 300 pps) Reverse Input Voltage VR 5 Volts “High” Peak Output Current IOH(PEAK) 0.6 A 2 “Low” Peak Output Current IOL(PEAK) 0.6 A 2 Supply Voltage (VCC - VEE) 0 35 Volts Output Voltage VO(PEAK) 0VCC Volts Output Power Dissipation PO 250 mW 3 Total Power Dissipation PT 295 mW 4 Lead Solder Temperature 260 °C for 10 sec., 1.6 mm below seating plane Solder Reflow Temperature Profile See Package Outline Drawings Section |
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Ähnliche Beschreibung - HCPL3150 |
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