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HCPL3150 Datenblatt(PDF) 4 Page - Agilent(Hewlett-Packard)

Teilenummer HCPL3150
Bauteilbeschribung  0.5 Amp Output Current IGBT Gate Drive Optocoupler
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Hersteller  HP [Agilent(Hewlett-Packard)]
Direct Link  http://www.home.agilent.com
Logo HP - Agilent(Hewlett-Packard)

HCPL3150 Datenblatt(HTML) 4 Page - Agilent(Hewlett-Packard)

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1-200
Recommended Operating Conditions
Parameter
Symbol
Min.
Max.
Units
Power Supply Voltage
(VCC - VEE)
15
30
Volts
Input Current (ON)
IF(ON)
716
mA
Input Voltage (OFF)
VF(OFF)
-3.0
0.8
V
Operating Temperature
TA
-40
100
°C
Insulation and Safety Related Specifications
Parameter
Symbol
Value
Units
Conditions
Minimum External Air Gap
L(101)
7.1
mm
Measured from input terminals to output
(External Clearance)
terminals, shortest distance through air.
Minimum External Tracking
L(102)
7.4
mm
Measured from input terminals to output
(External Creepage)
terminals, shortest distance path along body.
Minimum Internal Plastic Gap
0.08
mm
Through insulation distance conductor to
(Internal Clearance)
conductor.
Tracking Resistance
CTI
200
Volts
DIN IEC 112/VDE 0303 Part 1
(Comparative Tracking Index)
Isolation Group
IIIa
Material Group (DIN VDE 0110, 1/89, Table 1)
Option 300 - surface mount classification is Class A in accordance wtih CECC 00802.
Absolute Maximum Ratings
Parameter
Symbol
Min.
Max.
Units
Note
Storage Temperature
TS
-55
125
°C
Operating Temperature
TA
-40
100
°C
Average Input Current
IF(AVG)
25
mA
1
Peak Transient Input Current
IF(TRAN)
1.0
A
(<1
µs pulse width, 300 pps)
Reverse Input Voltage
VR
5
Volts
“High” Peak Output Current
IOH(PEAK)
0.6
A
2
“Low” Peak Output Current
IOL(PEAK)
0.6
A
2
Supply Voltage
(VCC - VEE)
0
35
Volts
Output Voltage
VO(PEAK)
0VCC
Volts
Output Power Dissipation
PO
250
mW
3
Total Power Dissipation
PT
295
mW
4
Lead Solder Temperature
260
°C for 10 sec., 1.6 mm below seating plane
Solder Reflow Temperature Profile
See Package Outline Drawings Section


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