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HCPL-6430 Datenblatt(PDF) 2 Page - Agilent(Hewlett-Packard)

Teilenummer HCPL-6430
Bauteilbeschribung  Hermetically Sealed, Very High Speed, Logic Gate Optocouplers
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Hersteller  HP [Agilent(Hewlett-Packard)]
Direct Link  http://www.home.agilent.com
Logo HP - Agilent(Hewlett-Packard)

HCPL-6430 Datenblatt(HTML) 2 Page - Agilent(Hewlett-Packard)

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Selection Guide–Package Styles and Lead Configuration Options
Package
8 Pin DIP
8 Pin DIP
20 Pad LCCC
Lead Style
Through Hole
Through Hole
Surface Mount
Channels
1
2
2
Common Channel
None
VCC, GND
None
Wiring
HP Part # & Options
Commercial
HCPL-5400
HCPL-5430
HCPL-6430
MIL-PRF-38534, Class H
HCPL-5401
HCPL-5431
HCPL-6431
MIL-PRF-38534, Class K
HCPL-540K
HCPL-543K
HCPL-643K
Standard Lead Finish
Gold Plate
Gold Plate
Solder Pads
Solder Dipped
Option #200
Option #200
Butt Cut/Gold Plate
Option #100
Option #100
Gull Wing/Soldered
Option #300
Option #300
SMD Part #
Prescript for all below
5962-
5962-
5962-
Either Gold or Solder
8957001PX
8957101PX
89571022X
Gold Plate
8957001PC
8957101PC
Solder Dipped
8957001PA
8957101PA
89571022A
Butt Cut/Gold Plate
8957001YC
8957101YC
Butt Cut/Soldered
8957001YA
8957101YA
Gull Wing/Soldered
8957001XA
8957101XA
data rate capability. The detector
has a threshold with hysteresis,
which typically provides 0.25 mA
of differential mode noise
immunity and minimizes the
potential for output signal
chatter. The detector in the single
channel units has a three state
output stage which eliminates the
need for a pull-up resistor and
allows for direct drive of a data
bus.
All units are compatible with TTL,
STTL, LSTTL, and HCMOS logic
families. The 35 ns pulse width
distortion specification guaran-
tees a 10 MBd signaling rate at
+125
°C with 35% pulse width
distortion. Figures 13 through 16
show recommended circuits for
reducing pulse width distortion
and optimizing the signal rate of
the product. Package styles for
these parts are 8 pin DIP through
hole (case outlines P), and
leadless ceramic chip carrier
(case outline 2). Devices may be
purchased with a variety of lead
bend and plating options. See
Selection Guide Table for details.
Standard Military Drawing (SMD)
parts are available for each
package and lead style.
Because the same electrical die
(emitters and detectors) are used
for each channel of each device
listed in this data sheet, absolute
maximum ratings, recommended
operating conditions, electrical
specifications, and performance
characteristics shown in the
figures are similar for all parts.
Occasional exceptions exist due
to package variations and limita-
tions and are as noted. Addition-
ally, the same package assembly
processes and materials are used
in all devices. These similarities
give justification for the use of
data obtained from one part to
represent other part’s perform-
ance for die related reliability and
certain limited radiation test
results.


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