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IRF630NSPBF Datenblatt(PDF) 1 Page - International Rectifier

Teilenummer IRF630NSPBF
Bauteilbeschribung  Advanced Process Technology
Download  11 Pages
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Hersteller  IRF [International Rectifier]
Direct Link  http://www.irf.com
Logo IRF - International Rectifier

IRF630NSPBF Datenblatt(HTML) 1 Page - International Rectifier

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HEXFET® Power MOSFET
07/23/10
Parameter
Max.
Units
ID @ TC = 25°C
Continuous Drain Current, VGS @ 10V
9.3
ID @ TC = 100°C
Continuous Drain Current, VGS @ 10V
6.5
A
IDM
Pulsed Drain Current

37
PD @TC = 25°C
Power Dissipation
82
W
Linear Derating Factor
0.5
W/°C
VGS
Gate-to-Source Voltage
±20
V
EAS
Single Pulse Avalanche Energy
‚
94
mJ
IAR
Avalanche Current

9.3
A
EAR
Repetitive Avalanche Energy

8.2
mJ
dv/dt
Peak Diode Recovery dv/dt
†
8.1
V/ns
TJ
Operating Junction and
-55 to +175
TSTG
Storage Temperature Range
Soldering Temperature, for 10 seconds
300 (1.6mm from case )
°C
Mounting torque, 6-32 or M3 srew
„
10 lbf•in (1.1N•m)
Absolute Maximum Ratings
Description
VDSS = 200V
RDS(on) = 0.30Ω
ID = 9.3A
S
D
G
l Advanced Process Technology
l Dynamic dv/dt Rating
l 175°C Operating Temperature
l Fast Switching
l Fully Avalanche Rated
l Ease of Paralleling
l Simple Drive Requirements
D2Pak
IRF630NSPbF
TO-220AB
IRF630NPbF
TO-262
IRF630NLPbF
IRF630NPbF
IRF630NSPbF
IRF630NLPbF
Fifth Generation HEXFET® Power MOSFETs from
International Rectifier utilize advanced processing techniques
to achieve extremely low on-resistance per silicon area.
This benefit, combined with the fast switching speed and
ruggedized device design that HEXFET Power MOSFETs
are well known for, provides the designer with an extremely
efficient and reliable device for use in a wide variety of
applications.
The TO-220 package is universally preferred for all
commercial-industrial applications at power dissipation levels
to approximately 50 watts. The low thermal resistance and
low package cost of the TO-220 contribute to its wide
acceptance throughout the industry.
The D2Pak is a surface mount power package capable of
accommodating die sizes up to HEX-4. It provides the
highest power capability and the lowest possible on-
resistance in any existing surface mount package. The
D2Pak is suitable for high current applications because of its
low internal connection resistance and can dissipate up to
2.0W in a typical surface mount application.
The through-hole version (IRF630NL) is available for low-
profile application.
www.irf.com
1
l Lead-Free
PD - 95047A


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