Datenblatt-Suchmaschine für elektronische Bauteile |
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CD4532BMS Datenblatt(PDF) 9 Page - Intersil Corporation |
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CD4532BMS Datenblatt(HTML) 9 Page - Intersil Corporation |
9 / 9 page 7-1235 CD4532BMS Chip Dimensions and Pad Layout FIGURE 12. 0-TO-9 KEYBOARD ENCODER TRUTH TABLE INPUT OUTPUT D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 GS Q3’ Q2’ Q1’ Q0’ 1 XXXXXXXXX 01001 0 1 XXXXXXXX 01000 0 0 1 XXXXXXX 10111 0001 XXXXXX 10110 00001 XXXXX 10101 000001 XXXX 10100 0000001 X X X 10011 00000001 X X 10010 000000001 X 10001 000000000110000 X = Don’t Care Logic 1 ≡ High Logic 0 ≡ Low Applications (Continued) GS Q2 Q1 Q0 EI D7 D0 D8 D9 Q3’ Q2’ Q1’ Q0’ 1/4 CD4071BMS CD4532BMS 1/4 CD4071BMS 1/6 CD4069BMS D7 D0 Dimensions in parenthesis are in millimeters and are derived from the basic inch dimensions as indicated. Grid graduations are in mils (10-3 inch). METALLIZATION: Thickness: 11k Å − 14kÅ, AL. PASSIVATION: 10.4kÅ - 15.6k Å, Silane BOND PADS: 0.004 inches X 0.004 inches MIN DIE THICKNESS: 0.0198 inches - 0.0218 inches |
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Ähnliche Beschreibung - CD4532BMS |
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