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IRF1010NL Datenblatt(PDF) 1 Page - Kersemi Electronic Co., Ltd.

Teilenummer IRF1010NL
Bauteilbeschribung  Fully Avalanche Rated
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Hersteller  KERSEMI [Kersemi Electronic Co., Ltd.]
Direct Link  http://www.kersemi.com
Logo KERSEMI - Kersemi Electronic Co., Ltd.

IRF1010NL Datenblatt(HTML) 1 Page - Kersemi Electronic Co., Ltd.

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IRF1010NS
IRF1010NL
VDSS = 55V
RDS(on) = 11mΩ
ID = 85A
‡
S
D
G
The D2Pak is a surface mount power package capable of
accommodating die sizes up to HEX-4. It provides the
highest power capability and the lowest possible on-
resistance in any existing surface mount package. The
D2Pak is suitable for high current applications because of its
low internal connection resistance and can dissipate up to
2.0W in a typical surface mount application.
The through-hole version (IRF1010NL) is available for low-
profile applications.
l Advanced Process Technology
l Ultra Low On-Resistance
l Dynamic dv/dt Rating
l 175°C Operating Temperature
l Fast Switching
l Fully Avalanche Rated
Description
Absolute Maximum Ratings
Parameter
Max.
Units
ID @ TC = 25°C
Continuous Drain Current, VGS @ 10V
ˆ
85
‡
ID @ TC = 100°C
Continuous Drain Current, VGS @ 10V
ˆ
60
A
IDM
Pulsed Drain Current
ˆ
290
PD @TC = 25°C
Power Dissipation
180
W
Linear Derating Factor
1.2
W/°C
VGS
Gate-to-Source Voltage
± 20
V
IAR
Avalanche Current

43
A
EAR
Repetitive Avalanche Energy

18
mJ
dv/dt
Peak Diode Recovery dv/dt
ƒˆ
3.6
V/ns
TJ
Operating Junction and
-55 to + 175
TSTG
Storage Temperature Range
Soldering Temperature, for 10 seconds
300 (1.6mm from case )
°C
Mounting torque, 6-32 or M3 srew
10 lbf•in (1.1N•m)
2
D
P ak
TO-26 2
IRF1010NL
IRF1010NS
Parameter
Typ.
Max.
Units
RθJC
Junction-to-Case
–––
0.85
RθJA
Junction-to-Ambient ( PCB Mounted,steady-state)**
–––
40
°C/W
Thermal Resistance
2014-8-30
1
www.kersemi.com


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