Datenblatt-Suchmaschine für elektronische Bauteile |
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IRF1407S Datenblatt(PDF) 1 Page - International Rectifier |
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IRF1407S Datenblatt(HTML) 1 Page - International Rectifier |
1 / 11 page Parameter Max. Units ID @ TC = 25°C Continuous Drain Current, VGS @ 10V X 100 V ID @ TC = 100°C Continuous Drain Current, VGS @ 10VX 70 V A IDM Pulsed Drain Current QX 520 PD @TA = 25°C Power Dissipation 3.8 W PD @TC = 25°C Power Dissipation 200 W Linear Derating Factor 1.3 W/°C VGS Gate-to-Source Voltage ± 20 V EAS Single Pulse Avalanche Energy RX 390 mJ IAR Avalanche Current Q See Fig.12a, 12b, 15, 16 A EAR Repetitive Avalanche Energy W mJ dv/dt Peak Diode Recovery dv/dt SX 4.6 V/ns TJ Operating Junction and -55 to + 175 TSTG Storage Temperature Range Soldering Temperature, for 10 seconds 300 (1.6mm from case ) °C HEXFET® Power MOSFET S D G Absolute Maximum Ratings VDSS = 75V RDS(on) = 0.0078Ω ID = 100A V Description 10/05/01 www.irf.com 1 q Advanced Process Technology q Ultra Low On-Resistance q Dynamic dv/dt Rating q 175°C Operating Temperature q Fast Switching q Repetitive Avalanche Allowed up to Tjmax Benefits PD -94335 Parameter Typ. Max. Units RθJC Junction-to-Case ––– 0.75 °C/W RθJA Junction-to-Ambient(PCB Mounted,steady-state)** ––– 40 Thermal Resistance IRF1407S IRF1407L TO-262 IRF1407L D2Pak IRF1407S Advanced HEXFET® Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications. The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D2Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application. The through-hole version (IRF1407L) is available for low- profile applications. **When mounted on 1" square PCB (FR-4 or G-10 Material). For recommended footprint and soldering techniques refer to application note #AN-994. |
Ähnliche Teilenummer - IRF1407S |
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Ähnliche Beschreibung - IRF1407S |
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