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Datenblatt-Suchmaschine für elektronische Bauteile |
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Datenblatt-Suchmaschine für elektronische Bauteile |
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IRF6712SPBF Datenblatt(PDF) 3 Page - International Rectifier |
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IRF6712SPBF Datenblatt(HTML) 3 Page - International Rectifier |
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3 / 9 page  www.irf.com © 2013 International Rectifier June 11, 2013 3 IRF6712SPbF Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient Used double sided cooling , mounting pad with large heatsink. Mounted on minimum footprint full size board with metalized back and with small clip heatsink. Notes: Ris measured at TJ of approximately 90°C. Surface mounted on 1 in. square Cu (still air). Mounted to a PCB with small clip heatsink (still air) Mounted on minimum footprint full size board with metalized back and with small clip heatsink (still air) 1E-006 1E-005 0.0001 0.001 0.01 0.1 1 10 100 1000 t1 , Rectangular Pulse Duration (sec) 0.001 0.01 0.1 1 10 100 0.20 0.10 D = 0.50 0.02 0.01 0.05 SINGLE PULSE ( THERMAL RESPONSE ) Notes: 1. Duty Factor D = t1/t2 2. Peak Tj = P dm x Zthja + Tc J J 1 1 2 2 3 3 R 1 R 1 R 2 R 2 R 3 R 3 Ci= iRi Ci= iRi 4 4 R 4 R 4 A A 5 5 R 5 R 5 Ri (°C/W) i (sec) 1.61955 0.000126 2.14056 0.001354 22.2887 0.375850 20.0457 7.41 11.9144 99 Absolute Maximum Ratings Parameter Units PD @TA = 25°C Power Dissipation e W PD @TA = 70°C Power Dissipation e PD @TC = 25°C Power Dissipation f TP Peak Soldering Temperature °C TJ Operating Junction and TSTG Storage Temperature Range Thermal Resistance Parameter Typ. Max. Units RJA Junction-to-Ambient el ––– 58 RJA Junction-to-Ambient jl 12.5 ––– RJA Junction-to-Ambient kl 20 ––– °C/W RJC Junction-to-Case fl ––– 3.5 RJ-PCB Junction-to-PCB Mounted 1.0 ––– Linear Derating Factor eà W/°C 0.017 270 -40 to + 150 Max. 36 2.2 1.4 |
Ähnliche Teilenummer - IRF6712SPBF_15 |
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Ähnliche Beschreibung - IRF6712SPBF_15 |
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