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Datenblatt-Suchmaschine für elektronische Bauteile |
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Datenblatt-Suchmaschine für elektronische Bauteile |
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IRF8306MPBF Datenblatt(PDF) 3 Page - International Rectifier |
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IRF8306MPBF Datenblatt(HTML) 3 Page - International Rectifier |
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3 / 10 page  3 www.irf.com © 2014 International Rectifier Submit Datasheet Feedback May 7, 2014 IRF8306MPbF Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient Used double sided cooling , mounting pad with large heatsink. Mounted on minimum footprint full size board with metalized back and with small clip heatsink. Notes: Rθ is measured at TJ of approximately 90°C. Surface mounted on 1 in. square Cu (still air). Mounted to a PCB with small clip heatsink (still air) Mounted on minimum footprint full size board with metalized back and with small clip heatsink (still air) 1E-006 1E-005 0.0001 0.001 0.01 0.1 1 10 100 t1 , Rectangular Pulse Duration (sec) 0.001 0.01 0.1 1 10 100 0.20 0.10 D = 0.50 0.02 0.01 0.05 SINGLE PULSE ( THERMAL RESPONSE ) Notes: 1. Duty Factor D = t1/t2 2. Peak Tj = P dm x Zthja + Tc Absolute Maximum Ratings Parameter Units PD @TA = 25°C Power Dissipation e W PD @TA = 70°C Power Dissipation e PD @TC = 25°C Power Dissipation f TP Peak Soldering Temperature °C TJ Operating Junction and TSTG Storage Temperature Range Thermal Resistance Parameter Typ. Max. Units RθJA Junction-to-Ambient el ––– 60 RθJA Junction-to-Ambient jl 12.5 ––– RθJA Junction-to-Ambient kl 20 ––– °C/W RθJC Junction-to-Case fl ––– 1.66 RθJ-PCB Junction-to-PCB Mounted 1.0 ––– Linear Derating Factor eà W/°C 0.017 270 -40 to + 150 Max. 75 2.1 1.3 Ri (°C/W) τι (sec) 24.84696 2.379018 10.92897 0.219018 3.658783 0.00733 20.42272 15.9657 τJ τJ τ1 τ1 τ2 τ2 τ3 τ3 R1 R1 R2 R2 R3 R3 Ci i /Ri Ci= τi/Ri τ τC τ4 τ4 R4 R4 |
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