NXP Semiconductors

BYC8-600

Hyperfast power diode

BYC8-600

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Product data sheet

23 May 2013

6 / 9

10. Package outline

References

Outline

version

European

projection

Issue date

IEC

JEDEC

JEITA

SOD59

2-lead TO-220AC

sod059_po

09-08-25

12-11-27

Unit

mm

max

nom

min

4.7

4.3

1.40

1.15

1.7

1.3

0.65

0.45

15.8

15.6

6.8

6.4

5.08

(REF)

16.25

15.70

3.80

3.65

A

Dimensions

Note

1. Protruded dambar are included in the dimension.

Plastic single-ended package; heatsink mounted; 1 mounting hole; 2-lead TO-220AC

SOD59

b

0.95

0.70

c

D

E

10.30

9.65

e

H

L

15.0

12.5

P

Q

2.6

2.2

q

2.9

2.7

0

5

10 mm

scale

c

A

Q

e

q

H

b

2

1

D

P

E

L

Fig. 7. Package outline TO-220AC (SOD59)