Datenblatt-Suchmaschine für elektronische Bauteile |
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74CBTLV3125 Datenblatt(PDF) 11 Page - NXP Semiconductors |
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74CBTLV3125 Datenblatt(HTML) 11 Page - NXP Semiconductors |
11 / 17 page 74CBTLV3125 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 3 — 15 December 2011 11 of 17 NXP Semiconductors 74CBTLV3125 4-bit bus switch 12. Package outline Fig 18. Package outline SOT519-1 (SSOP16) UNIT A1 A2 A3 bp cD (1) E (1) eHE LLp Z y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.25 0.10 1.55 1.40 0.25 0.31 0.20 0.25 0.18 5.0 4.8 4.0 3.8 0.635 1 6.2 5.8 0.89 0.41 0.18 0.05 8 0 o o 0.18 0.2 0.09 DIMENSIONS (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. SOT519-1 99-05-04 03-02-18 (1) w M bp D HE E Z e c v M A X A y 1 8 16 9 θ A A1 A2 L p detail X L (A ) 3 0 2.5 5 mm scale SSOP16: plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635 mm SOT519-1 A max. 1.73 |
Ähnliche Teilenummer - 74CBTLV3125_15 |
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Ähnliche Beschreibung - 74CBTLV3125_15 |
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