IRFAG30

2

www.irf.com

Thermal Resistance

Parameter

Min Typ Max

Units

Test Conditions

RthJC

Junction to Case

—

—

1.67

RthJA

Junction to Ambient

—

—

30

Typical socket mount

°C/W

Source-Drain Diode Ratings and Characteristics

Parameter

Min Typ

Max Units

Test Conditions

IS

Continuous Source Current (Body Diode)

—

—

2.3

ISM

Pulse Source Current (Body Diode) ➀

—

—

9.2

VSD

Diode Forward Voltage

—

—

1.8

V

trr

Reverse Recovery Time

—

—

470

nS

Tj = 25°C, IF =2.3A, di/dt ≤ 100A/µs

QRR

Reverse Recovery Charge

—

—

1.7

µC

VDD ≤ 50V ➃

t on

Forward Turn-On Time

Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by LS + LD.

A

For footnotes refer to the last page

Parameter

Min

Typ

Max Units

Test Conditions

BVDSS

Drain-to-Source Breakdown Voltage

1000

—

—

V

VGS = 0V, ID = 1.0mA

∆BVDSS/∆TJ Temperature Coefficient of Breakdown

—

1.4

—

V/°C

Reference to 25°C, ID = 1.0mA

Voltage

RDS(on)

Static Drain-to-Source On-State

—

—

5.6

VGS = 10V, ID =1.5A ➃

Resistance

—

—

6.5

VGS =10V, ID =2.3A ➃

VGS(th)

Gate Threshold Voltage

2.0

—

4.0

V

VDS = VGS, ID =250µA

gfs

Forward Transconductance

2.1

—

—

S ( )VDS > 15V, IDS =1.5A ➃

IDSS

Zero Gate Voltage Drain Current

—

—

2 5

VDS = 800V, VGS = 0V

—

—

250

VDS = 800V

VGS = 0V, TJ = 125°C

IGSS

Gate-to-Source Leakage Forward

—

—

100

VGS = 20V

IGSS

Gate-to-Source Leakage Reverse

—

—

-100

VGS = -20V

Qg

Total Gate Charge

3 0

—

6 8

VGS = 10V, ID = 2.3A

Qgs

Gate-to-Source Charge

2.5

—

6.3

nC

VDS = 500V

Qgd

Gate-to-Drain (‘Miller’) Charge

1 6

—

3 6

Turn-On Delay Time

—

—

2 3

VDD = 400V*, ID =2.3A,

t r

Rise Time

—

—

4 2

RG =7..5Ω

Turn-Off Delay Time

—

—

210

tf

Fall Time

—

—

6 0

LS + LD

Total Inductance

—

6.1

—

Ciss

Input Capacitance

—

980

VGS = 0V, VDS = 25V

Coss

Output Capacitance

—

140

—

pF

f = 1.0MHz

Crss

Reverse Transfer Capacitance

—

5 0

—

nA

nH

ns

µA

Ω

Measured from drain lead (6mm/0.25in. from

package) to source lead (6mm/0.25in. from

package)

*Equipment Limitation