Datenblatt-Suchmaschine für elektronische Bauteile |
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AD4C312 Datenblatt(PDF) 4 Page - Solid State Optronic |
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AD4C312 Datenblatt(HTML) 4 Page - Solid State Optronic |
4 / 8 page © 2013 Solid State Optronics • San José, CA www.ssousa.com • +1.408.293.4600 Page 4 of 8 AD4C312/H/S/TR Rev 2.00 (09/05/2013) 001630 AD4C312 Dual 1 Form B 400V / 15 Ω MOSFET Output Solid State Relay Process Step Description Parameter A Preheat Start Temperature (ºC) 150ºC B Preheat Finish Temperature (ºC) 180ºC C Preheat Time (s) 90 - 120s D Melting Temperature (ºC) 230ºC E Time above Melting Temperature (s) 30s F Peak Temperature, at Terminal (ºC) 260ºC G Dwell Time at Peak Temperature (s) 10s H Cool-down (ºC/s) <6ºC/s AD4C312 Solder Temperature Profile Recommendations (1) Infrared Reflow: Refer to the following figure as an example of an optimal temperature profile for single occurrence infrared reflow. Soldering process should not exceed temperature or time limits expressed herein. Surface temperature of device package should not exceed 250ºC: A B C D F E G H (2) Wave Solder: (3) Hand Solder: Maximum Temperature: 260ºC (at terminal) Maximum Time: 10s Pre-heating: 100 - 150ºC (30 - 90s) Single Occurrence Maximum Temperature: 350ºC (at tip of soldering iron) Maximum Time: 3s Single Occurrence Figure 1 |
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