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LM117HVQML-SP Datenblatt(PDF) 4 Page - Texas Instruments

Teilenummer LM117HVQML-SP
Bauteilbeschribung  LM117HVQML 3-Terminal Adjustable Regulator
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LM117HVQML-SP Datenblatt(HTML) 4 Page - Texas Instruments

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LM117HVQML, LM117HVQML-SP
SNVS357D – MARCH 2006 – REVISED APRIL 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)
Power Dissipation(2)
Internally limited
Input - Output Voltage Differential
+60V,
−0.3V
Maximum Junction Temperature
+150°C
Storage Temperature
−65°C ≤ TA ≤ +150°C
Lead Temperature (Soldering, 10 sec.)
300°C
Thermal Resistance
θJA
TO Metal Can - Still Air
39°C/W
TO Metal Can - 500LF/Min Air flow
14°C/W
TO Metal Can - Still Air
186°C/W
TO Metal Can - 500LF/Min Air flow
64°C/W
CFP "WG" (device 01, 61) - Still Air
115°C/W
CFP "WG" (device 01, 61) - 500LF/Min Air flow
66°C/W
CFP "GW" (device 02, 62) - Still Air
130°C/W
CFP "GW" (device 02, 62) - 500LF/Min Air flow
80°C/W
θJC
TO Metal Can
1.9°C/W
TO Metal Can
21°C/W
CFP "WG" (device 01, 61)(3)
3.4°C/W
CFP "GW" (device 02, 62)
7°C/W
ESD Tolerance(4)
2000V
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(2)
The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature),
θJA (package junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any
temperature is PDmax = (TJmax - TA) / θJA or the number given in the Absolute Maximum Ratings, whichever is lower. "Although power
dissipation is internally limited, these specifications are applicable for power dissipations of 2W for the PFM package and 20W for the
TO package."
(3)
The package material for these devices allows much improved heat transfer over our standard ceramic packages. In order to take full
advantage of this improved heat transfer, heat sinking must be provided between the package base (directly beneath the die), and either
metal traces on, or thermal vias through, the printed circuit board. Without this additional heat sinking, device power dissipation must be
calculated using
θJA, rather than θJC, thermal resistance. It must not be assumed that the device leads will provide substantial heat
transfer out the package, since the thermal resistance of the lead frame material is very poor, relative to the material of the package
base. The stated
θJC thermal resistance is for the package material only, and does not account for the additional thermal resistance
between the package base and the printed circuit board. The user must determine the value of the additional thermal resistance and
must combine this with the stated value for the package, to calculate the total allowed power dissipation for the device.
(4)
Human body model, 1.5 k
Ω in series with 100 pF.
Recommended Operating Conditions
Operating Temperature Range
−55°C ≤ TA ≤ +125°C
Table 2. Quality Conformance Inspection
Mil-Std-883, Method 5005 - Group A
Subgroup
Description
Temp °C
1
Static tests at
25
2
Static tests at
125
3
Static tests at
-55
4
Dynamic tests at
25
5
Dynamic tests at
125
6
Dynamic tests at
-55
7
Functional tests at
25
8A
Functional tests at
125
4
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Copyright © 2006–2013, Texas Instruments Incorporated
Product Folder Links: LM117HVQML LM117HVQML-SP


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