LM3643, LM3643A

SNVS967A – AUGUST 2014 – REVISED NOVEMBER 2014

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8 Specifications

8.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

IN, SW, OUT, LED1, LED2

−0.3

6

V

SDA, SCL, TX, TORCH/TEMP, HWEN, STROBE

−0.3 to the lesser of

Internally limited

150

°C

Maximum lead temperature (soldering)

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the potential at the GND terminal.

(3)

(4)

For detailed soldering specifications and information, please refer to TI Application Note DSBGA Wafer Level Chip Scale Package

(SNVA009).

8.2 Handling Ratings

MIN

MAX

UNIT

Storage temperature range

−65

150

°C

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

−2500

2500

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification

−1500

1500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

8.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

2.5

5.5

V

−40

125

°C

(3)

−40

85

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the potential at the GND terminal.

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

8.4 Thermal Information

LM3643

DSBGA

UNIT

12 PINS

Junction-to-ambient thermal resistance

67.8

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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