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TS5A3359 Datenblatt(PDF) 4 Page - Texas Instruments

Teilenummer TS5A3359
Bauteilbeschribung  TS5A3359 1-廓 SP3T Bidirectional Analog Switch 5-V/3.3-V Single-Channel 3:1 Multiplexer and Demultiplexer
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Hersteller  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

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TS5A3359
SCDS214D – OCTOBER 2005 – REVISED MAY 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2)
MIN
MAX
UNIT
VCC
Supply voltage(3)
–0.5
6.5
V
VNO
Analog voltage(3) (4) (5)
–0.5
VCC + 0.5
V
VCOM
IK
Analog port diode current
VNO, VCOM < 0
–50
mA
INO
–200
200
On-state switch current
VNO, VCOM = 0 to VCC
mA
ICOM
–400
400
VI
Digital input voltage(3) (4)
–0.5
6.5
V
IIK
Digital input clamp current
VI < 0
–50
mA
ICC
Continuous current through VCC
100
mA
IGND
Continuous current through GND
–100
100
mA
Tstg
Storage temperature
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum
(3)
All voltages are with respect to ground, unless otherwise specified.
(4)
The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(5)
This value is limited to 5.5-V maximum.
6.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)
±2000
V(ESD)
Electrostatic discharge
V
Charged device model (CDM), per JEDEC specification JESD22-C101, all
±1000
pins(2)
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VCC
1.65
5.5
V
Analog voltage
VNO
0
VCC
V
VCOM
VI
Digital input voltage
0
VCC
V
6.4 Thermal Information
TS5A3359
THERMAL METRIC(1)
DCU (US8)
YZP (DSBGA)
UNIT
8 PINS
8 PINS
RθJA
Junction-to-ambient thermal resistance
204.2
105.8
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
76.2
1.6
°C/W
RθJB
Junction-to-board thermal resistance
82.9
10.8
°C/W
ψJT
Junction-to-top characterization parameter
7.6
3.1
°C/W
ψJB
Junction-to-board characterization parameter
82.5
10.8
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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