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ISL22343TFR20Z Datenblatt(PDF) 3 Page - Intersil Corporation |
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ISL22343TFR20Z Datenblatt(HTML) 3 Page - Intersil Corporation |
3 / 19 page 3 FN6423.2 August 17, 2015 Pin Descriptions TSSOP PIN QFN PIN SYMBOL DESCRIPTION 1 19 RH3 “High” terminal of DCP3 2 20 RL3 “Low” terminal of DCP3 3 1 RW3 “Wiper” terminal of DCP3 4 2 A2 Device address input for the I2C interface 5 3 SCL Open drain I2C interface clock input 6 4 SDA Open drain Serial data I/O for the I2C interface 7 5 GND Device ground pin 8 6 RW2 “Wiper” terminal of DCP2 9 7 RL2 “Low” terminal of DCP2 10 8 RH2 “High” terminal of DCP2 11 9 RW1 “Wiper” terminal of DCP1 12 10 RL1 “Low” terminal of DCP1 13 11 RH1 “High” terminal of DCP1 14 12 A0 Device address input for the I2C interface 15 13 A1 Device address input for the I2C interface 16 14 VCC Positive power supply pin 17 15 V- Negative power supply pin 18 16 RH0 “High” terminal of DCP0 19 17 RL0 “Low” terminal of DCP0 20 18 RW0 “Wiper” terminal of DCP0 EPAD* Exposed Die Pad internally connected to V- NOTE: *PCB thermal land for QFN EPAD should be connected to V- plane or left floating. For more information refer to http://www.intersil.com/data/tb/TB389.pdf ISL22343 |
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