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TPA3005D2 Datenblatt(PDF) 2 Page - Texas Instruments |
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TPA3005D2 Datenblatt(HTML) 2 Page - Texas Instruments |
2 / 31 page TPA3005D2 SLOS427A – MAY 2004 – REVISED AUGUST 2010 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. AVAILABLE OPTIONS PACKAGED DEVICE TA 48-PIN HTQFP (PHP)(1) (2) -40°C to 85°C TPA3005D2PHP (1) The PHP package is available taped and reeled. To order a taped and reeled part, add the suffix R to the part number (e.g., TPA3005D2PHPR). (2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) TPA3005D2 Supply voltage range AVCC, PVCC -0.3 V to 20 V Load Impedance, RL ≥ 6 Ω SHUTDOWN -0.3 V to VCC + 0.3 V Input voltage range, VI GAIN0, GAIN1, RINN, RINP, LINN, LINP -0.3 V to 6 V Continuous total power dissipation See Thermal Information Table Operating free–air temperature range, TA - 40°C to 85°C Operating junction temperature range, TJ - 40°C to 150°C Storage temperature range, Tstg - 65°C to 150°C (1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. THERMAL INFORMATION TPA3005D2 THERMAL METRIC(1) (2) UNITS PHP (48 PINS) qJA Junction-to-ambient thermal resistance 27.7 qJCtop Junction-to-case (top) thermal resistance 14.8 qJB Junction-to-board thermal resistance 9.4 °C/W yJT Junction-to-top characterization parameter 0.6 yJB Junction-to-board characterization parameter 5.6 qJCbot Junction-to-case (bottom) thermal resistance 0.3 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator. RECOMMENDED OPERATING CONDITIONS MIN MAX UNIT Supply voltage, VCC PVCC, AVCC 8.5 18 V High-level input voltage, VIH SHUTDOWN, GAIN0, GAIN1 2 V Low-level input voltage, VIL SHUTDOWN, GAIN0, GAIN1 0.8 V SHUTDOWN, VI = VCC = 18 V 10 µA High-level input current, IIH GAIN0, GAIN1, VI = 5.5 V, VCC = 18 V 1 µA SHUTDOWN, VI = 0 V, VCC = 18 V 1 µA Low-level input current, IIL GAIN0, GAIN1, VI = 5.5 V, VCC = 18 V 1 µA Frequency is set by selection of ROSC and COSC (see the 200 300 Oscillator frequency, fOSC kHz Application Information Section). Operating free–air temperature, TA -40 85 °C 2 Submit Documentation Feedback Copyright © 2004–2010, Texas Instruments Incorporated Product Folder Link(s): TPA3005D2 |
Ähnliche Teilenummer - TPA3005D2_15 |
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Ähnliche Beschreibung - TPA3005D2_15 |
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