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LM2937ES-15 Datenblatt(PDF) 4 Page - Texas Instruments

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Teilenummer LM2937ES-15
Bauteilbeschribung  500-mA Low Dropout Regulator
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Hersteller  TI [Texas Instruments]
Direct Link  http://www.ti.com
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LM2937
SNVS100F – MARCH 2000 – REVISED JULY 2014
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
(1) (2)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
Continuous
26
Input voltage (VIN)
V
Transient (t
≤ 100 ms)
60
Internal power dissipation(3)
Internally limited
Maximum junction temperature
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3)
The maximum allowable power dissipation at any ambient temperature is PMAX = (125°C − TA)/RθJA, where 125 is the maximum junction
temperature for operation, TA is the ambient temperature, and RθJA is the junction-to-ambient thermal resistance. If this dissipation is
exceeded, the die temperature will rise above 125°C and the electrical specifications do not apply. If the die temperature rises above
150°C, the LM2937 will go into thermal shutdown.
6.2 Handling Ratings
MIN
MAX
UNIT
Tstg
Storage temperature range
−65
150
°C
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
–2000
2000
V(ESD)
Electrostatic discharge
V
pins(1)
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
(1)
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
LM2937ET (NDE), LM2937ES (KTT)
−40
125
Junction temperature (TJ)
(2)
°C
LM2937IMP (DCY)
−40
85
Input voltage (VIN)
VOUT + 1V
26
V
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
The maximum allowable power dissipation at any ambient temperature is PMAX = (125°C − TA)/RθJA, where 125°C is the maximum
junction temperature for operation, TA is the ambient temperature, and RθJA is the junction-to-ambient thermal resistance. If this
dissipation is exceeded, the die temperature will rise above 125°C and the electrical specifications do not apply. If the die temperature
rises above 150°C, the LM2937 will go into thermal shutdown.
6.4 Thermal Information
LM2937
THERMAL METRIC(1)
NDE(2)
KTT
DCY
UNIT
3 PINS
3 PINS
4 PINS
RθJA
Junction-to-ambient thermal resistance
77.9
41.8
58.3
RθJC(top)
Junction-to-case (top) thermal resistance
35.5
43.5
39.2
RθJB
Junction-to-board thermal resistance
70.6
0.8
N/A
°C/W
ψJT
Junction-to-top characterization parameter
13
23.5
7
ψJB
Junction-to-board characterization parameter
70.6
10.3
1.6
RθJC(bot)
Junction-to-case (bottom) thermal resistance
1
22.5
22.5
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2)
Thermal information for the TO-220 package is for a free-standing package vertically mounted in the middle of a PCB which is compliant
to the JEDEC HIGH-K 2s2p (JESD51-7) specifications. No additional heat sink is attached. See Heatsinking TO-220 Package Parts
section for more information.
4
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Product Folder Links: LM2937


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