TMP75B

SBOS706B – APRIL 2014 – REVISED AUGUST 2014

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

4

V

SDA, SCL, ALERT, A2, A1

-0.3

4

V

Input voltage

A0

-0.3

V

Sink current

SDA, ALERT

10

mA

Operating junction temperature

-55

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 Handling Ratings

MIN

MAX

UNIT

Storage temperature range

-60

150

°C

–2000

2000

Electrostatic

V

discharge

–1000

1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage

1.4

1.8

3.6

V

-55

125

°C

6.4 Thermal Information

TMP75B

D (SOIC)

DGK (VSSOP)

UNIT

8 PINS

8 PINS

Junction-to-ambient thermal resistance

125.4

188.1

Junction-to-case (top) thermal resistance

71.5

79.1

Junction-to-board thermal resistance

65.8

109.6

°C/W

Junction-to-top characterization parameter

21.1

15.3

Junction-to-board characterization parameter

65.3

108

Junction-to-case (bottom) thermal resistance

N/A

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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