TMP107-Q1

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SBOS726A – OCTOBER 2015 – REVISED OCTOBER 2015

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage, V+

6

V

I/O1, I/O2

–0.3

(V+) + 0.3

Input voltage

R1, R2

–0.3

6

V

ALERT1, ALERT2

–0.3

6

Sink current

ALERT1, ALERT2

10

mA

Operating junction

–55

150

Temperature

°C

–60

150

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

Charged-device model (CDM), per AEC Q100-011

±1000

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage, V+

1.7

3.3

5.5

V

–55

125

°C

7.4 Thermal Information

TMP107-Q1

D (SOIC)

UNIT

8 PINS

Junction-to-ambient thermal resistance

116.3

°C/W

Junction-to-case (top) thermal resistance

62.5

°C/W

Junction-to-board thermal resistance

56.6

°C/W

Junction-to-top characterization parameter

14.6

°C/W

Junction-to-board characterization parameter

56.0

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

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