Datenblatt-Suchmaschine für elektronische Bauteile |
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TL331IDBVRG4 Datenblatt(PDF) 4 Page - Texas Instruments |
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TL331IDBVRG4 Datenblatt(HTML) 4 Page - Texas Instruments |
4 / 18 page TL331 SLVS238G – AUGUST 1999 – REVISED JANUARY 2015 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VCC Supply voltage(2) 0 36 V VID Differential input voltage(3) –36 36 V VI Input voltage range (either input) –0.3 36 V VO Output voltage 0 36 V IO Output current 0 20 mA Duration of output short-circuit to ground(4) Unlimited TJ Operating virtual junction temperature –40 150 °C Tstg Storage temperature range –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values, except differential voltages, are with respect to the network ground. (3) Differential voltages are at IN+ with respect to IN–. (4) Short circuits from outputs to VCC can cause excessive heating and eventual destruction. 7.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±1000 V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification JESD22-C101, ±750 all pins(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC Supply voltage 2 36 V TJ Junction Temperature -40 125 °C 7.4 Thermal Information TL331 THERMAL METRIC(1) DBV UNIT 5 PINS RθJA Junction-to-ambient thermal resistance 218.3 RθJC(top) Junction-to-case (top) thermal resistance 87.3 RθJB Junction-to-board thermal resistance 44.9 °C/W ψJT Junction-to-top characterization parameter 4.3 ψJB Junction-to-board characterization parameter 44.1 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated Product Folder Links: TL331 |
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