Datenblatt-Suchmaschine für elektronische Bauteile |
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ULN2066B Datenblatt(PDF) 9 Page - STMicroelectronics |
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ULN2066B Datenblatt(HTML) 9 Page - STMicroelectronics |
9 / 14 page ULN2064B, ULN2066B, ULN2068B, ULN2074B Mounting instructions 9/14 6 Mounting instructions The RthJA can be reduced by soldering the GND pins to a suitable copper area of the printed circuit board (Figure 14) or to an external heatsink (Figure 15). The diagram of Figure 16 shows the maximum dissipated power PTOT and the RthJA as a function of the side " α" of two equal square copper areas having a thickness of 35 µ (1.4 mils). During soldering the pins temperature must not exceed 260 °C and the soldering time must not be longer than 12 seconds. The external heatsink or printed circuit copper area must be connected to electrical ground. Figure 14. Example of P.C. board area which is used as heatsink Figure 15. External heatsink mounting example Figure 16. Maximum dissipated power and junction to ambient thermal resistance vs. side " α" Figure 17. Maximum allowable power dissipation vs. ambient temperature |
Ähnliche Teilenummer - ULN2066B |
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Ähnliche Beschreibung - ULN2066B |
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