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Datenblatt-Suchmaschine für elektronische Bauteile |
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Datenblatt-Suchmaschine für elektronische Bauteile |
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TPA2005D1DGNR Datenblatt(PDF) 3 Page - Texas Instruments |
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TPA2005D1DGNR Datenblatt(HTML) 3 Page - Texas Instruments |
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3 / 42 page  8 SHUTDOWN NC IN+ IN− VO− GND VDD VO+ 7 6 5 1 2 3 4 NC − No internal connection VO− GND VDD VO+ 8 7 6 5 1 2 3 4 SHUTDOWN NC IN+ IN− (A1) (B1) (A4) (C4) (D4) NC VDD SHUTDOWN IN+ IN− VO− VDD VO+ (C1) (D1) (B4) GND SHUTDOWN TPA2005D1 www.ti.com SLOS369G – JULY 2002 – REVISED OCTOBER 2015 5 Device Comparison Table DEVICE SPEAKER SPEAKER AMP OUTPUT POWER PSRR (dB) SUPPLY MIN (V) SUPPLY MAX (V) PACKAGE NUMBER CHANNELS TYPE (W) FAMILY BGA MICROSTAR JUNIOR TPA2005D1 Mono Class D 1.4 75 2.5 5.5 HVSSOP VSON TPA2006D1 Mono Class D 1.45 75 2.5 5.5 VSON 6 Pin Configuration and Functions GQY and ZQY Packages DRB Package DGN Package 15-Pin MicroStar Junior™ 8-Pin VSON 8-Pin HVSSOP Top and Side Views Top View Top View A. The shaded terminals are used for electrical and thermal connections to the ground plane. All the shaded terminals need to be electrically connected to ground. No connect (NC) terminals still need a pad and trace. B. The thermal pad of the DRB and DGN packages must be electrically and thermally connected to a ground plane. Pin Functions PIN I/O DESCRIPTION NAME GQY, ZQY DRB, DGN A2, A3, B3, C2, C3, GND 7 I High-current ground D2, D3 IN- D1 4 I Negative differential input IN+ C1 3 I Positive differential input NC B1 2 No internal connection SHUTDOWN A1 1 I Shutdown terminal (active low logic) Thermal Pad Must be soldered to a grounded pad on the PCB. VDD B4, C4 6 I Power supply VO- A4 8 O Negative BTL output VO+ D4 5 O Positive BTL output Copyright © 2002–2015, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: TPA2005D1 |
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