Datenblatt-Suchmaschine für elektronische Bauteile |
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SI7006-A20 Datenblatt(PDF) 5 Page - Silicon Laboratories |
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SI7006-A20 Datenblatt(HTML) 5 Page - Silicon Laboratories |
5 / 35 page Si7006-A20 Rev. 1.1 5 Conversion Time1 tCONV 12-bit RH — 10 12 ms 11-bit RH — 5.8 7 10-bit RH — 3.7 4.5 8-bit RH — 2.6 3.1 14-bit temperature — 7 10.8 13-bit temperature — 4 6.2 12-bit temperature — 2.4 3.8 11-bit temperature — 1.5 2.4 Powerup Time tPU From VDD ≥ 1.9 V to ready for a conversion, 25 °C —18 25 ms From VDD ≥ 1.9 V to ready for a conversion, full temperature range —— 80 After issuing a software reset command —5 15 Table 3. I2C Interface Specifications1 1.9 VDD 3.6 V; TA = –40 to +125 °C unless otherwise noted. Parameter Symbol Test Condition Min Typ Max Unit Hysteresis VHYS High-to-low versus low-to- high transition 0.05 x VDD —— V SCLK Frequency2 fSCL — — 400 kHz SCL High Time tSKH 0.6 — — μs SCL Low Time tSKL 1.3 — — μs Start Hold Time tSTH 0.6 — — μs Start Setup Time tSTS 0.6 — — μs Notes: 1. All values are referenced to VIL and/or VIH. 2. Depending on the conversion command, the Si7006 may hold the master during the conversion (clock stretch). At above 100 kHz SCL, the Si7006 may also hold the master briefly for user register and device ID transactions. At the highest I2C speed of 400 kHz the stretching will be <50 μs. 3. Pulses up to and including 50 ns will be suppressed. Table 2. General Specifications (Continued) 1.9 < VDD < 3.6 V; TA = –40 to 125 °C default conversion time unless otherwise noted. Parameter Symbol Test Condition Min Typ Max Unit Notes: 1. Initiating a RH measurement will also automatically initiate a temperature measurement. The total conversion time will be tCONV(RH) + tCONV(T). 2. No conversion or I2C transaction in progress. Typical values measured at 25 °C. 3. Occurs once during powerup. Duration is <5 msec. 4. Occurs during I2C commands for Reset, Read/Write User Registers, Read EID, and Read Firmware Version. Duration is <100 μs when I2C clock speed is >100 kHz (>200 kHz for 2-byte commands). 5. Additional current consumption when HTRE bit enabled. See Section “5.5. Heater” for more information. |
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