Datenblatt-Suchmaschine für elektronische Bauteile |
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SL2305SI-1H Datenblatt(PDF) 9 Page - Silicon Laboratories |
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SL2305SI-1H Datenblatt(HTML) 9 Page - Silicon Laboratories |
9 / 11 page Rev 2.1, October 22, 2007 Page 9 of 11 SL2305 Package Outline and Package Dimensions 8-Pin SOIC Package (150-mil) 1 4 8 5 0.150(3.810) 0.157(3.987 0.230(5.842) 0.244(6.197) 0.189(4.800) 0.196(4.978) 0.050(1.270) BSC 0.0138(0.350) 0.0192(0.487) 0.004(0.102) Seating plane 0.004(0.102) 0.0098(0.249) 0.061(1.549) 0.068(1.727) 0° to 8° 0.010(0.2540) 0.016(0.406) X 45° 0.016(0.406) 0.035(0.889) 0.0075(0.190) 0.0098(0.249) Pin-1 ID Dimensions are in inches(milimeters). Top line: (MIN) and Bottom line: (Max) Thermal Characteristics Parameter Symbol Condition Min Typ Max Unit Thermal Resistance Junction to Ambient θ JA Still air - 150 - °C/W θ JA 1m/s air flow - 140 - °C/W θ JA 3m/s air flow - 120 - °C/W Thermal Resistance Junction to Case θ JC Independent of air flow - 40 - °C/W |
Ähnliche Teilenummer - SL2305SI-1H |
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Ähnliche Beschreibung - SL2305SI-1H |
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