Datenblatt-Suchmaschine für elektronische Bauteile |
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STPTIC-68F1M6 Datenblatt(PDF) 5 Page - STMicroelectronics |
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STPTIC-68F1M6 Datenblatt(HTML) 5 Page - STMicroelectronics |
5 / 13 page DocID023772 Rev 4 5/13 STPTIC Package information 13 3 Package information • Epoxy meets UL94, V0 • Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 2. µQFN-6L package dimension Figure 3. Recommended PCB land pattern for µQFN-6L package C2 C1 C2 A2 B2 B1 C1 A1 1.2 mm 0.05 mm ± 0.7 mm 0.425 mm 0.35 mm ± 0.03 mm 0.9 mm ± 0.1 mm 0.25 mm ± 0.03 mm 0.5 mm 550 µm 600 µm 300 µm Top Metal NC RF1 RF1 Bias NC RF2 Solder mask opening RF1 RF2 RF1 250 µm 300 µm 200 µm |
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Ähnliche Beschreibung - STPTIC-68F1M6 |
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