TMP815

SLDS153B – MAY 2009 – REVISED NOVEMBER 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

18

V

Output voltage

OUT1P, OUT1N, OUT2P, OUT2N

18

V

OUT1N, OUT2N

–20

Continuous output current

mA

OUT1P, OUT2P

20

Input voltage

VTH, RMI

7

V

Input/output voltage

S-S

7

V

Output voltage

FG

19

V

Continuous output current

FG

10

mA

5VREG

–20

mA

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE

UNIT

±2500

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification JESD22-C101, all

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN

MAX

UNIT

Supply voltage

6

16

V

VTH input voltage

0

5

V

RMI input voltage

0

5

V

Hall input common phase input voltage

0.2

3

V

Operating free-air temperature

–40

125

°C

6.4 Thermal Information

TMP815

PW (TSSOP)

UNIT

16 PINS

Junction-to-ambient thermal resistance

108

°C/W

Junction-to-case (top) thermal resistance

94.2

°C/W

Junction-to-board thermal resistance

31.5

°C/W

Junction-to-top characterization parameter

38.9

°C/W

Junction-to-board characterization parameter

1.9

°C/W

Junction-to-case (bottom) thermal resistance

38.3

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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