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74AVC16T245DGGRG4 Datenblatt(PDF) 6 Page - Texas Instruments |
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74AVC16T245DGGRG4 Datenblatt(HTML) 6 Page - Texas Instruments |
6 / 28 page SN74AVC16T245 SCES551E – FEBRUARY 2004 – REVISED NOVEMBER 2015 www.ti.com 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) (2) (3) VCCI VCCO MIN MAX UNIT VCCA Supply voltage 1.2 3.6 V VCCB Supply voltage 1.2 3.6 V 1.2 V to 1.95 V VCCI × 0.65 High-level VIH Data inputs(4) 1.95 V to 2.7 V 1.6 V input voltage 2.7 V to 3.6 V 2 1.2 V to 1.95 V VCCI × 0.35 Low-level VIL Data inputs(4) 1.95 V to 2.7 V 0.7 V input voltage 2.7 V to 3.6 V 0.8 1.2 V to 1.95 V VCCA × 0.65 DIR High-level VIH (referenced to 1.95 V to 2.7 V 1.6 V input voltage VCCA) (5) 2.7 V to 3.6 V 2 1.2 V to 1.95 V VCCA × 0.35 DIR Low-level VIL (referenced to 1.95 V to 2.7 V 0.7 V input voltage VCCA) (5) 2.7 V to 3.6 V 0.8 VI Input voltage 0 3.6 V Active state 0 VCCO VO Output voltage V Tri-State 0 3.6 1.2 V –3 1.4 V to 1.6 V –6 IOH High-level output current 1.65 V to 1.95 V –8 mA 2.3 V to 2.7 V –9 3 V to 3.6 V –12 1.2 V 3 1.4 V to 1.6 V 6 IOL Low-level output current 1.65 V to 1.95 V 8 mA 2.3 V to 2.7 V 9 3 V to 3.6 V 12 Δt/Δv Input transition rise or fall rate 5 ns/V TA Operating free-air temperature –40 85 °C (1) VCCI is the VCC associated with the data input port. (2) VCCO is the VCC associated with the output port. (3) All unused data inputs of the device must be held at VCCI or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, SCBA004. (4) For VCCI values not specified in the data sheet, VIH min = VCCI × 0.7 V, VIL max = VCCI × 0.3 V. (5) For VCCA values not specified in the data sheet, VIH min = VCCA × 0.7 V, VIL max = VCCA × 0.3 V. 7.4 Thermal Information SN74AVC16T245 DGV DGG ZQL THERMAL METRIC(1) UNIT (TVSOP) (TSSOP) (BGA MICROSTAR JUNIOR) 48 PINS 48 PINS 56 PINS RθJA Junction-to-ambient thermal resistance 82.5 69.9 64.6 °C/W RθJC(top) Junction-to-case (top) thermal resistance 34.2 23.9 16.6 °C/W RθJB Junction-to-board thermal resistance 45.1 36.6 30.8 °C/W ψJT Junction-to-top characterization parameter 2.7 1.7 0.9 °C/W ψJB Junction-to-board characterization parameter 44.6 36.2 64.6 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6 Submit Documentation Feedback Copyright © 2004–2015, Texas Instruments Incorporated Product Folder Links: SN74AVC16T245 |
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