Datenblatt-Suchmaschine für elektronische Bauteile |
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74F219SC Datenblatt(PDF) 5 Page - National Semiconductor (TI) |
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74F219SC Datenblatt(HTML) 5 Page - National Semiconductor (TI) |
5 / 8 page Ordering Information The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows 74F 219 S C X Temperature Range Family Special Variations 74F e Commercial QB e Military grade device with 54F e Military environmental and burn-in processing Device Type X e Devices shipped in 13 reel Package Code Temperature Range P e Plastic DIP C e Commercial (0 Cto a70 C) D e Ceramic DIP L e Military (b55 Cto a100 C) F e Flatpak L e Leadless Chip Carrier (LCC) S e Small Outline SOIC JEDEC SJ e Small Outline SOIC EIAJ Physical Dimensions inches (millimeters) 20-Lead Ceramic Leadless Chip Carrier (L) NS Package Number E20A 5 |
Ähnliche Teilenummer - 74F219SC |
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Ähnliche Beschreibung - 74F219SC |
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