2001-08-24

Page 2

Preliminary data

SPI70N10L

SPP70N10L,SPB70N10L

Thermal Characteristics

Parameter

Symbol

Values

Unit

min.

typ.

max.

Characteristics

Thermal resistance, junction - case

-

-

0.6

K/W

Thermal resistance, junction - ambient, leaded

-

-

62.5

SMD version, device on PCB:

@ min. footprint

-

-

-

-

62

40

Parameter

Symbol

Values

Unit

min.

typ.

max.

Static Characteristics

Drain-source breakdown voltage

100

-

-

V

1.2

1.6

2

Zero gate voltage drain current

-

-

0.1

-

1

100

µA

Gate-source leakage current

-

10

100

nA

Drain-source on-state resistance

-

14

25

m

Drain-source on-state resistance

-

10

16

1Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain

connection. PCB is vertical without blown air.