Datenblatt-Suchmaschine für elektronische Bauteile |
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TS33001-M008QFNR Datenblatt(PDF) 11 Page - Semtech Corporation |
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TS33001-M008QFNR Datenblatt(HTML) 11 Page - Semtech Corporation |
11 / 16 page TS33001/2/3 Final Datasheet Rev 1.6 January 15, 2016 www.semtech.com 11 of 16 Semtech Proprietary & Confidential Mold compound Die Epoxy Die attach Exposed pad Solder 5% - 10% Cu coverage Single Layer, 2oz Cu Ground Layer, 1oz Cu Signal Layer, 1oz Cu Bottom Layer, 2oz Cu Thermal Vias with Cu plating 90% Cu coverage 20% Cu coverage Note: NOT to Scale The above drawing is a representation of how the heat can be conducted away from the die using an exposed pad package. Each application will have different requirements and limitations and therefore the user should use sufficient copper to dissipate the power in the system. The output current rating for the linear regulators may have to be de-rated for ambient temperatures above 85C. The de-rate value will depend on calculated worst case power dissipation and the thermal management implementation in the application. Application Using A Single Layer PCB Use as much Copper Area as possible for heat spread Package Thermal Pad Package Outline Layout recommendations for a Single Layer PCB: utilize as much Copper Area for Power Management. In a single layer board application the thermal pad is attached to a heat spreader (copper areas) by using low thermal impedance attachment method (solder paste or thermal conductive epoxy). In both of the methods mentioned above it is advisable to use as much copper traces as possible to dissipate the heat. IMPORTANT: If the attachment method is NOT implemented correctly, the functionality of the product is not guaranteed. Power dissipation capability will be adversely affected if the device is incorrectly mounted onto the circuit board. |
Ähnliche Teilenummer - TS33001-M008QFNR |
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Ähnliche Beschreibung - TS33001-M008QFNR |
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