5

LMZ34202

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SNVSAJ2 – MARCH 2016

Product Folder Links: LMZ34202

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Copyright © 2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The maximum voltage that can be applied to these pins is 30 V or PVIN, whichever is less.

(3)

See temperature derating curves in the Typical Characteristics section for thermal information.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Input voltage

PVIN, INH/UVLO

–0.3

50

V

VOUT, SENSE+, VBSEL

–0.3

V

VADJ, VERSA-COMP, RT, RTSEL, SS/TR

–0.3

3.6

V

PWRGD, PWRGD_PU

–0.3

15

V

CLK

–0.3

5.5

V

Output voltage

PH

–0.3

50

V

–40

125

°C

Mechanical shock

Mil-STD-883D, Method 2002.3, 1 msec, 1/2 sine, mounted

1500

G

Mechanical vibration

Mil-STD-883D, Method 2007.2, 20-2000Hz

20

G

Storage temperature,

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±1000

V

±1000

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Input voltage

4.5

42

V

Output voltage

2.5

7.5

V

Switching frequency

300

1000

kHz

Operating ambient temperature

–40

105

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.4 Thermal Information

LMZ34202

UNIT

RVQ (QFN)

43 PINS

Junction-to-ambient thermal resistance

14

°C/W

Junction-to-top characterization parameter

2.6

°C/W

Junction-to-board characterization parameter

9

°C/W