4

LM2854

SNVS560D – MARCH 2008 – REVISED JANUARY 2016

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Copyright © 2008–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3)

PGND and AGND are electrically connected together on the PC board and the resultant net is termed GND.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

–0.3

6

V

Power Dissipation

Internally Limited

Junction Temperature

150

°C

Storage Temperature

−65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

The human body model is a 100-pF capacitor discharged through a 1.5-k

Ω resistor into each pin. Test method is per JESD22-AI14.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

(1)

PGND and AGND are electrically connected together on the PC board and the resultant net is termed GND.

6.3 Recommended Operating Conditions

MIN

MAX

UNIT

2.95

5.5

V

2.95

5.5

V

Junction Temperature

−40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.4 Thermal Information

LM2854

UNIT

PWP (HTSSOP)

16 PINS

Junction-to-ambient thermal resistance

38.4

°C/W

Junction-to-case (top) thermal resistance

27.6

°C/W

Junction-to-board thermal resistance

17.1

°C/W

Junction-to-top characterization parameter

1.5

°C/W

Junction-to-board characterization parameter

16.9

°C/W

Junction-to-case (bottom) thermal resistance

1.3

°C/W