LM25019

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SNVS952E – DECEMBER 2012 – REVISED NOVEMBER 2015

6 Specifications

6.1 Absolute Maximum Ratings

(1)

MIN

MAX

UNIT

–0.3

53

V

SW to RTN

–1.5

V

SW to RTN (100 ns transient)

–5

V

BST to VCC

53

V

BST to SW

13

V

RON to RTN

–0.3

53

V

VCC to RTN

–0.3

13

V

FB to RTN

–0.3

5

V

200

°C

150

°C

–55

150

°C

(1)

Absolute Maximum Ratings are limits beyond which damage to the device may occur. Recommended Operating Conditions are

conditions under which operation of the device is intended to be functional. For specifications and test conditions, see Electrical

Characteristics . The RTN pin is the GND reference electrically connected to the substrate.

(2)

For detailed information on soldering plastic SO Power PAD-8 package, refer to the Packaging Data Book available from Texas

Instruments. Max solder time not to exceed 4 seconds.

(3)

High junction temperatures degrade operating lifetimes. Operating lifetime is de-rated for junction temperatures greater than 125°C.

6.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±750

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

7.5

48

V

−40

125

°C

(1)

Recommended Operating Conditions are conditions under the device is intended to be functional. For specifications and test conditions,

see Electrical Characteristics.

(2)

High junction temperatures degrade operating lifetimes. Operating lifetime is de-rated for junction temperatures greater than 125°C.

6.4 Thermal Information

LM25019

SO PowerPAD

WSON NGU

UNIT

DDA

8 PINS

Junction-to-ambient thermal resistance

41.3

41.1

°C/W

Junction-to-case (bottom) thermal resistance

3.2

2.4

°C/W

Junction-to-board thermal characteristic parameter

19.2

24.4

°C/W

Junction-to-board thermal resistance

19.1

30.6

°C/W

Junction-to-case (top) thermal resistance

34.7

37.3

°C/W

Junction-to-top thermal characteristic parameter

0.3

6.7

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).

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