Datenblatt-Suchmaschine für elektronische Bauteile |
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TPA3250D2DDWR Datenblatt(PDF) 3 Page - Texas Instruments |
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TPA3250D2DDWR Datenblatt(HTML) 3 Page - Texas Instruments |
3 / 41 page Thermal Pad 1 GVDD_CD 44 BST_D 2 CLIP_OTW 43 BST_C 3 VBG 42 GND 4 FAULT 41 GND 5 RESET 40 OUT_D 6 INPUT_D 39 OUT_D 7 INPUT_C 38 PVDD_CD 8 C_START 37 PVDD_CD 9 AVDD 36 PVDD_CD 10 GND 35 OUT_C 11 GND 34 GND 12 DVDD 33 GND 13 OSC_IOP 32 OUT_B 14 OSC_IOM 31 PVDD_AB 15 FREQ_ADJ 30 PVDD_AB 16 OC_ADJ 29 PVDD_AB 17 INPUT_A 28 OUT_A 18 INPUT_B 27 OUT_A 19 M2 26 GND 20 M1 25 GND 21 VDD 24 BST_B 22 GVDD_AB 23 BST_A 3 TPA3250 www.ti.com SLASE99A – DECEMBER 2015 – REVISED APRIL 2016 Product Folder Links: TPA3250 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated 5 Device Comparison Table DEVICE NAME DESCRIPTION TPA3251 175-W Stereo Class-D PurePath™ Ultra-HD Analog Input Audio Power Amplifier TPA3116D2 50W Filter-Free Class-D Stereo Amplifier Family with AM Avoidance TPA3118D2 30W Filter-Free Class-D Stereo Amplifier Family with AM Avoidance 6 Pin Configuration and Functions The TPA3250 is available in a thermally enhanced TSSOP package. The package type contains a PowerPad™ that is located on the bottom side of the device for thermal connection to the PCB. DDV Package HTSSOP 44-Pin (Top View) |
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Ähnliche Beschreibung - TPA3250D2DDWR |
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